10M50DCF484I7G vs 10M50DAF484I7P Comparison

Detailed side-by-side comparison of 10M50DCF484I7G by Intel and 10M50DAF484I7P by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DCF484I7G 10M50DAF484I7P
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $99.60 $112.00
Family MAX 10 —
Logic Elements 50,000 —
Embedded SRAM 1,677,312 bits (1.6 Mb) —
User Flash Memory Up to 5,888 Kb (on-chip dual configuration) —
Maximum User I/O Pins 360 —
LVDS Channels (dedicated) 160 (rx + tx) —
PLLs 4 8 (general-purpose, fractional on selected devices)
18x18 Hardware Multipliers 144 —
Package 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch 484-ball FineLine BGA (F484)
Core Voltage 1.2 V (internal) —
Process Technology TSMC 55 nm embedded flash —
Operating Junction Temperature -40C to +100C (industrial, 'I' suffix) —
Speed Grade 7 (fastest commercial/industrial) 7 (slowest industrial bin, highest margin)
Configuration Mode On-chip flash + JTAG —
Integrated ADC 12-bit, up to 17 channels, 1 MSPS —
Mounting Type Surface Mount (BGA) —
RoHS Status Compliant Compliant
Product Family — MAX 10
Logic Elements (LE) — 50,000
Embedded Memory (bits) — 1,677,312
Embedded Memory Blocks — M9K (and M144K)
18x18 Multipliers — 312
User I/O Pins (max) — 360
Pitch — 1.0 mm
Process Node — 55 nm embedded flash (TSMC)
On-die Configuration Flash — Yes (non-volatile, instant-on)
On-die ADC — Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs
Global Clock Networks — 20
Operating Temperature — -40C to +100C (Tj, industrial)
Configuration Modes — Internal flash, JTAG, dual-boot image support

Datasheets & Resources

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