10M50DCF484I7G vs 10M50DAF484I7P 对比

详细并排对比 10M50DCF484I7G 出自 Intel 和 10M50DAF484I7P 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10M50DCF484I7G 10M50DCF484I7G - MAX 10 FPGA 50K LE 484-FBGA | Intel

10M50DCF484I7G - MAX 10 FPGA 50K LE 484-FBGA | Intel

10M50DCF484I7G ✓ 量产中

规格对比

参数 10M50DCF484I7G 10M50DAF484I7P
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $99.60 $112.00
Family MAX 10 —
Logic Elements 50,000 —
Embedded SRAM 1,677,312 bits (1.6 Mb) —
User Flash Memory Up to 5,888 Kb (on-chip dual configuration) —
Maximum User I/O Pins 360 —
LVDS Channels (dedicated) 160 (rx + tx) —
PLLs 4 8 (general-purpose, fractional on selected devices)
18x18 Hardware Multipliers 144 —
封装 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch 484-ball FineLine BGA (F484)
Core Voltage 1.2 V (internal) —
Process Technology TSMC 55 nm embedded flash —
工作结温 -40C to +100C (industrial, 'I' suffix) —
Speed Grade 7 (fastest commercial/industrial) 7 (slowest industrial bin, highest margin)
Configuration Mode On-chip flash + JTAG —
Integrated ADC 12-bit, up to 17 channels, 1 MSPS —
安装类型 Surface Mount (BGA) —
RoHS 状态 Compliant Compliant
Product Family — MAX 10
Logic Elements (LE) — 50,000
Embedded Memory (bits) — 1,677,312
Embedded Memory Blocks — M9K (and M144K)
18x18 Multipliers — 312
User I/O Pins (max) — 360
Pitch — 1.0 mm
Process Node — 55 nm embedded flash (TSMC)
On-die Configuration Flash — Yes (non-volatile, instant-on)
On-die ADC — Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs
Global Clock Networks — 20
工作温度 — -40C to +100C (Tj, industrial)
Configuration Modes — Internal flash, JTAG, dual-boot image support

数据手册与资源

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