10M50DCF484I7G - MAX 10 FPGA 50K LE 484-FBGA | Intel
MPN: 10M50DCF484I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $132.1 | $1,321.00 |
| 100 | $118.75 | $11,875.00 |
| 250 | $109.4 | $27,350.00 |
| 500 | $99.6 | $49,800.00 |
10M50DCF484I7G Overview
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks such as PLLs, DSP blocks, and high-speed transceivers. Within the broader hierarchy, the MAX 10 belongs to the non-volatile FPGA class - a sub-category of programmable logic devices (PLDs) - and is positioned as a low-power, instant-on replacement for CPLDs and small SRAM FPGAs in glue-logic, control, and bridging applications.
Key features of the 10M50DCF484I7G include 360 general-purpose I/O pins (LVDS-capable), 4 PLLs, 144 (18x18) hardware multipliers, dual configuration flash with on-chip flash boot, an integrated ADC (12-bit, up to 17 channels), and support for external memory interfaces up to DDR3/LPDDR2. Hardened Nios II soft-core capability allows embedded processor integration without external CPUs. The 484-FBGA (F484) package has a body size of 23 x 23 mm with 1.0 mm ball pitch.
Architecturally, MAX 10 FPGAs use a logic-element fabric of 8-input adaptive LUTs distributed across LABs, fed by a multi-tier routing hierarchy. The 10M50 variant places the device at the mid-density point of the MAX 10 family (between 10M25 and 10M08 at the lower end and the original Cyclone V derivatives at the higher end), making it suitable for designs that outgrow CPLDs but do not require Cyclone 10 or Arria-class resources.
Typical applications for the 10M50DCF484I7G include industrial motor and motion control, I/O expansion and bridging (PCIe Gen2 root port, I2C/SPI/UART), video processing and display controllers, factory automation PLC interfaces, and portable test equipment. The integrated ADC enables sensor aggregation on the same die.
When designing with this device, pay attention to the I/O bank supply structure: the F484 package supports 8 I/O banks plus a dedicated configuration/JTAG bank. Each bank requires its own VCCIO supply, and unused banks must still be powered to a valid level (typically 2.5 V) to keep I/O buffers in a defined state. The device also requires a 10 kohm external pull-up on the nCONFIG pin during configuration boot.
This page synthesizes distributor pricing, drop-in pin-compatible variants from the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for 10M50DCF484I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M50DCF484I7G (same form factor and footprint) — differing in Package, Process Technology, Configuration Memory, Speed Grade, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M50DAF484I7G
✅ Drop-In✓ In Stock
$58.2 / Unit
View Datasheet →10M50DCF484I7P
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
10M50DCF484I6G
✅ Drop-In✓ In Stock
$52.75 / Unit
View Datasheet →10M50DCF484C8G
✅ Drop-In✓ In Stock
$106.16 / Unit
View Datasheet →10M50DCF484C7G
✅ Drop-In✓ In Stock
$48.9 / Unit
View Datasheet →10M40DCF484I7G
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$71.48 / Unit
View Datasheet →10M50DCF484I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 50,000 |
| Embedded SRAM | 1,677,312 bits (1.6 Mb) |
| User Flash Memory | Up to 5,888 Kb (on-chip dual configuration) |
| Maximum User I/O Pins | 360 |
| LVDS Channels (dedicated) | 160 (rx + tx) |
| PLLs | 4 |
| 18x18 Hardware Multipliers | 144 |
| Package | 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch |
| Core Voltage | 1.2 V (internal) |
| Process Technology | TSMC 55 nm embedded flash |
| Operating Junction Temperature | -40C to +100C (industrial, 'I' suffix) |
| Speed Grade | 7 (fastest commercial/industrial) |
| Configuration Mode | On-chip flash + JTAG |
| Integrated ADC | 12-bit, up to 17 channels, 1 MSPS |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10M50DCF484I7G 484-ball fbga (f484), 23x23 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for 10M50DCF484I7G (484-ball fbga (f484), 23x23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DCF484I7G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M50DCF484I7G is suitable for 6 applications: Industrial Motor and Motion Control, I/O Expansion and Protocol Bridging, Video Processing and Display Controllers, Factory Automation PLC Interface, Portable Test and Measurement Equipment, Automotive Infotainment and Driver Assistance Sub-Systems.
Industrial Motor and Motion Control
The 10M50DCF484I7G fits multi-axis industrial motor control because it integrates 50,000 logic elements for state machines and PWM generation, 144 hardware 18x18 multipliers to implement field-oriented control (FOC) and Clarke/Park transforms, and 4 PLLs for precise PWM-carrier synchronization. The integrated 12-bit SAR ADC samples phase currents at 1 MSPS, eliminating an external ADC for closed-loop current sensing. With the -40C to +100C industrial junction temperature and 360 user I/O pins, a single device can drive two to four BLDC or servo axes while also handling encoder inputs (EnDat, BiSS, SSI), over-current protection, and CAN/CAN-FD communication. Engineers save BOM cost by replacing MCU-plus-CPLD or MCU-plus-SRAM-FPGA architectures with one non-volatile MAX 10 device, and the instant-on dual-boot flash supports safe firmware updates in field-deployed drives.
Recommended
I/O Expansion and Protocol Bridging
The 10M50DCF484I7G is widely used as a glue-logic and protocol-bridging device between heterogeneous interfaces on industrial motherboards. With 360 LVDS-capable user I/O and 8 I/O banks, the F484 BGA can simultaneously bridge PCIe Gen2 root ports to local-bus ASICs, expand I2C/SPI/UART fan-outs, and aggregate GPIOs from sensors. The 50K LE capacity comfortably fits soft IP cores such as UART, I2C master/slave, SPI, and even lightweight RISC-V or Nios II processors. The on-chip dual-configuration flash supports field firmware upgrades via the system host CPU. Compared to a CPLD-based design, the MAX 10 provides far more logic capacity and 1.6 Mb embedded SRAM for packet buffering; compared to a Cyclone V, the MAX 10 is more power-efficient and instant-on from flash with no external boot PROM.
Recommended
Video Processing and Display Controllers
The 10M50DCF484I7G serves in video format conversion, frame-rate conversion, and display timing controller applications. The 50K logic elements and 1.6 Mb embedded SRAM implement line buffers and SDRAM controllers for mid-resolution video (up to 1080p60), while the integrated PLLs generate pixel clocks for HDMI, LVDS, or MIPI DSI panel interfaces. The dedicated 18x18 multipliers accelerate color-space conversion (RGB/YUV) and scaler kernels. Designers typically pair the MAX 10 with an external DDR2/DDR3 memory device for frame buffering and use its 360 I/O to drive multi-lane LVDS display interfaces. The non-volatile flash boot enables instant display initialization at power-up, critical for kiosk and signage applications that must show an image within 100 ms of power-on.
Recommended
Factory Automation PLC Interface
In factory automation, the 10M50DCF484I7G provides a robust programmable platform for programmable logic controllers (PLCs), distributed I/O nodes, and industrial gateways. Its 360 I/O pins support dozens of digital-input channels (24 V opto-isolated), high-speed counters, and PWM outputs to motor starters or solenoid drivers. The -40C to +100C industrial junction temperature tolerates cabinet temperatures behind a sealed enclosure, while the integrated 12-bit ADC digitizes analog sensor inputs (pressure, flow, temperature) directly. The dual on-chip configuration flash supports IEC 61131-3 firmware updates via Modbus TCP or PROFINET without external boot memory. Compared to MCU-only PLCs, the MAX 10 offers deterministic parallel logic execution and far more I/O bandwidth.
Recommended
Portable Test and Measurement Equipment
The 10M50DCF484I7G fits portable oscilloscopes, logic analyzers, and bench-top instrumentation because it combines dense parallel DSP logic (144 hardware multipliers for FFT/DFT), 1.6 Mb SRAM for sample buffers, and a 484-FBGA footprint that still fits within a hand-held enclosure's thermal budget. The integrated 12-bit ADC (up to 17 channels) digitizes low-speed analog inputs without an external ADC, while external high-speed ADCs feed LVDS data into the FPGA's 360 I/O pins for waveform capture. The on-chip flash boot eliminates an external boot PROM, shrinking the BOM for cost-sensitive test gear. Engineers use the MAX 10's Nios II soft-core capability to host a small embedded CPU for user-interface and USB connectivity tasks, replacing a separate MCU.
Recommended
Automotive Infotainment and Driver Assistance Sub-Systems
Although the 10M50DCF484I7G is industrial-grade rather than full AEC-Q100 automotive, it serves well in cabin-mounted sub-systems such as head-unit display controllers, body controllers, and ADAS sensor aggregation nodes where operating junction stays under +100C. The MAX 10's instant-on flash boot meets automotive <200 ms cold-start requirements, and its 144 hardware multipliers accelerate camera ISP and lane-detection algorithms. The 360 I/O pins aggregate multiple CSI-2 / LVDS camera streams, while the integrated ADC monitors supply rails and temperature sensors. Designers targeting AEC-Q100 should migrate to the 10M50DAF484I7G variant which provides enhanced qualification. The non-volatile configuration eliminates external boot PROMs, reducing PCB area in space-constrained behind-dash modules.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DCF484I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DAF484I7G | 10M50DCF484I7P | 10M50DCF484I6G | 10M50DCF484C8G | 10M50DCF484C7G | 10M40DCF484I7G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F484), 23x23 mm | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 40,000 |
| Speed Grade | 7 (fastest) | 7 | 7 | 6 (slower) | 8 (slowest) | 7 | 7 |
| Temperature Grade | Industrial (-40C to +100C Tj) | Industrial (-40C to +100C Tj) | Industrial (-40C to +100C Tj) | Industrial (-40C to +100C Tj) | Commercial (0C to +85C Tj) | Commercial (0C to +85C Tj) | Industrial (-40C to +100C Tj) |
| Embedded SRAM | 1,677,312 bits (1.6 Mb) | 1,677,312 bits | 1,677,312 bits | 1,677,312 bits | 1,677,312 bits | 1,677,312 bits | 1,342,464 bits (1.28 Mb) |
| User Flash | 5,888 Kb dual-config | 5,888 Kb | 5,888 Kb | 5,888 Kb | 5,888 Kb | 5,888 Kb | 4,608 Kb |
| Maximum User I/O | 360 | 360 | 360 | 360 | 360 | 360 | 360 |
| Hardware Multipliers (18x18) | 144 | 144 | 144 | 144 | 144 | 144 | 112 |
| Approx. Unit Price (USD, qty 1) | 142.50 | 160.00 (estimate, automotive) | 140.00 (estimate, tray) | 130.00 | 118.00 | 125.00 | 115.00 |
Key Differentiators
- Pin-compatible upgrade to enhanced DSP variant in same F484 package (vs 10M50DAF484I7G)
- Lower-density drop-in when cost dominates over logic capacity (vs 10M40DCF484I7G)
- Industrial-grade over commercial for harsh environments (vs 10M50DCF484C7G)
Design Notes
The MAX 10 F484 device uses an internal linear regulator that converts VCCIO_8 (2.5 V or 3.3 V) to a 1.2 V core. Per the Intel MAX 10 device handbook, the VCCIO_8 bank MUST be powered to 2.5 V or 3.3 V for the internal regulator to start; if VCCIO_8 is below 2.0 V at power-up, configuration will fail. Decouple VCCINT_PLL, VCCIO (per bank), VCC, VCCA, and VCCD_PLL with 100 nF X7R 0402 capacitors placed as close as possible to each ball. Add 10 uF bulk caps at the PCB power inlet. Estimated: at 100 MHz internal clock and 50% toggle rate, total core power is approximately 0.6 W; industrial thermal envelopes are easily met with the F484's 23x23 mm footprint and standard 8-layer PCB copper pour.
The F484 FBGA uses 1.0 mm ball pitch, which requires 0.5 mm laser-drilled micro-vias on 4-layer or 6-layer stack-ups. Per Intel MAX 10 PCB design guidelines, route signal traces on the top layer with via-in-pad or dog-bone fanouts; use 50 ohm controlled impedance for LVDS pairs and 90 ohm for differential. Escape the inner balls of the BGA through the bottom layer using blind/buried vias. Place all decoupling capacitors on the opposite side of the BGA, directly beneath their respective supply balls, with vias within 1 mm of the cap pad. Maintain a continuous reference plane under the entire BGA to control return-path impedance.
Common MAX 10 design pitfalls: (1) Floating CONFIG_SEL pins - both CONF_DONE and nCONFIG must have external 10 kohm pull-ups to VCCIO_8. (2) Using the wrong JTAG voltage - TCK/TMS/TDO/TDI are referenced to VCCIO_8 (2.5 V or 3.3 V); connecting a 1.8 V JTAG probe will damage the bank. (3) Forgetting dual-boot flash layout - the UFM and CFM0/CFM1 sectors need a single contiguous image; mis-sizing the user flash partition causes configuration failures. (4) Driving LVDS into a bank without its 2.5 V VCCIO - LVDS requires VCCIO = 2.5 V exactly. (5) Routing high-speed clocks through the same bank as slow GPIOs - this causes signal-integrity violations. Always run Quartus Prime TimeQuest timing analysis before tape-out.
For the F484 package, the theta_JA is approximately 14 C/W with a standard 8-layer JEDEC test board, which means at 1.0 W total dissipation the junction temperature rises only 14C above ambient. Estimated: in a sealed industrial enclosure with 50C ambient, junction temperature will be below 100C even at full 50K LE utilization. If the design is placed in a forced-air-cooled chassis with >2 m/s airflow, theta_JA drops below 8 C/W. For automotive under-hood environments exceeding +100C ambient, derate by 30% or use the automotive-grade 10M50DAF484I7G variant instead.
Compliance Information
RoHS and REACH compliance per Intel product declaration. Industrial temperature grade (I suffix) covers -40C to +100C Tj but is NOT AEC-Q100 qualified - migrate to 10M50DAF484I7G variant for automotive. Halogen-free status not confirmed in provided data.
