10M50DCF672I7G vs 10M40DCF672I7G Comparison

Detailed side-by-side comparison of 10M50DCF672I7G by Intel and 10M40DCF672I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M50DCF672I7G 10M40DCF672I7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $212.00 $72.65
Family MAX® 10 —
Logic Elements (LE) 50,000 —
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K 9-Kbit blocks —
DSP Blocks (18x18 Multipliers) 144 —
User I/Os 500 —
Package 672-ball FBGA (FineLine BGA), 1.0 mm pitch 672-ball FBGA (1.0 mm pitch)
Process Technology 55 nm —
Core Supply Voltage 1.2 V 1.2 V
Configuration Memory On-chip dual-configuration flash On-die flash (non-volatile, dual-image)
User Flash Memory (UFM) [DATA_NEEDED: UFM size in Kbits] —
PLLs 4 general-purpose 4
Global Clock Networks [DATA_NEEDED: global clock count] 16
Integrated ADC 12-bit SAR, 1 MSPS, up to 17 analog input channels —
Temperature Sensor On-die diode —
On-chip Voltage Regulators Yes (internal core regulation) —
Operating Temperature (Industrial) -40C to +100C (I7 grade) —
Speed Grade 7 —
RoHS Status Compliant —
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level 3 (per JEDEC J-STD-020) 3
Configuration Interface JTAG, Active Serial (AS), Passive Serial (PS) —
Product Family — MAX 10
Logic Elements (LEs) — 40,000
Embedded Memory (M9K blocks) — 2,500 Kbits
Embedded User Flash — 1,290,240 bits
User I/O Count (max) — 500
Multipliers (18x18) — 144
Process Node — 55 nm
Operating Temperature Range — -40 C to +100 C (industrial)
Hard Memory Controller — DDR3 / LPDDR2 (integrated)
On-die ADC — Yes (1 MSPS, 12-bit equivalent)

Datasheets & Resources

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