10M50DCF672I7G - MAX 10 FPGA, 50K LE, 672-FBGA | Intel
MPN: 10M50DCF672I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $269 | $2,690.00 |
| 100 | $245 | $24,500.00 |
| 250 | $228 | $57,000.00 |
| 500 | $212 | $106,000.00 |
Drop-in alternatives for 10M50DCF672I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M50DCF672C8G
✅ Drop-In✓ In Stock
$51.75 / Unit
View Datasheet →10M50DCF672C7G
✅ Drop-In✓ In Stock
$65.97 / Unit
View Datasheet →10M50DAF672I7G
✅ Drop-In✓ In Stock
$144.2 / Unit
View Datasheet →10M40DCF672I7G
✅ Drop-In✓ In Stock
$72.65 / Unit
View Datasheet →10M50DAF672C8G
✅ Drop-In✓ In Stock
$97.6 / Unit
View Datasheet →10M50DCF672I7G Maximum Ratings & Electrical Characteristics
| Family | MAX® 10 |
| Logic Elements (LE) | 50,000 |
| Embedded Memory (bits) | 1,677,312 |
| Embedded Memory Blocks | M9K 9-Kbit blocks |
| DSP Blocks (18x18 Multipliers) | 144 |
| User I/Os | 500 |
| Package | 672-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Process Technology | 55 nm |
| Core Supply Voltage | 1.2 V |
| Configuration Memory | On-chip dual-configuration flash |
| PLLs | 4 general-purpose |
| Integrated ADC | 12-bit SAR, 1 MSPS, up to 17 analog input channels |
| Temperature Sensor | On-die diode |
| On-chip Voltage Regulators | Yes (internal core regulation) |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade) |
| Speed Grade | 7 |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Configuration Interface | JTAG, Active Serial (AS), Passive Serial (PS) |
10M50DCF672I7G 672-ball fbga (fineline bga), 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10M50DCF672I7G (672-ball fbga (fineline bga), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M50DCF672I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M50DCF672I7G is suitable for 6 applications: Industrial Motor Control, Video Bridging and Image Processing, Factory Automation I/O Expansion, Portable Medical Instrumentation, Low-Cost PCIe Endpoint Bridging, IoT Edge Sensor Aggregation.
Industrial Motor Control
The 10M50DCF672I7G is well suited for industrial motor control because its 144 18x18 DSP blocks and 50K logic elements deliver real-time field-oriented control (FOC) for three-phase PMSM and induction motors at switching frequencies up to 100 kHz. The integrated 12-bit SAR ADC with 17 analog channels samples motor phase currents, DC-bus voltage, and temperature sensors without an external analog front end, reducing BOM cost. Industrial temperature grade (-40C to +100C) and instant-on dual-configuration flash support fail-safe field firmware upgrades in factory automation cells.
Recommended
Video Bridging and Image Processing
The 10M50DCF672I7G's 500 user I/Os and LVDS support at up to 500 Mbps enable bridging between MIPI CSI-2, parallel CMOS, and LVDS image sensors, making it ideal for industrial camera and machine-vision systems. The 1,677,312 bits of embedded SRAM buffer full-HD frames line-by-line for image preprocessing (gamma, lens correction) before forwarding over Ethernet or USB 3.0 bridges. The 55 nm low-power process keeps typical core power under 1.5 W, allowing fanless embedded designs in surveillance and inspection equipment.
Recommended
Factory Automation I/O Expansion
As a programmable I/O expansion hub, the 10M50DCF672I7G aggregates Profinet, EtherCAT, RS-485, and discrete I/O signals onto a single industrial Ethernet backbone. The 500 GPIO support up to 24 banks of mixed-voltage I/O (1.2 V to 3.3 V), simplifying interface to legacy 5 V sensors via level shifting in the FPGA fabric. Industrial temperature operation and embedded flash support instant-on behavior at power-up with zero boot latency, critical for safety-rated control loops where boot-PROM delay is unacceptable.
Recommended
Portable Medical Instrumentation
The 10M50DCF672I7G's integrated 12-bit SAR ADC and on-die temperature sensor make it a strong fit for portable medical devices such as pulse oximeters, glucometers, and bedside monitors. The dual-configuration flash enables secure firmware updates with rollback capability, while the 1.2 V core and on-chip voltage regulators reduce total board footprint for battery-powered form factors. Industrial-grade silicon qualified to -40C to +100C supports clinical and field environments where temperature extremes are common.
Recommended
Low-Cost PCIe Endpoint Bridging
The 10M50DCF672I7G supports PCIe Gen2 x1 endpoint implementations through its hard PCIe block (where present in the F672 variant) or soft IP for legacy 32-bit/66 MHz PCI. Designers use the abundant 500 I/Os and 144 multipliers for protocol translation between PCIe and parallel buses, NAND flash controllers, or legacy peripherals. Instant-on flash ensures link training begins within milliseconds of power-up, matching the timing budget of host platforms that expect quick device enumeration.
Recommended
IoT Edge Sensor Aggregation
The 10M50DCF672I7G aggregates multiple low-speed sensor buses (SPI, I2C, UART, 1-Wire) into a single high-speed uplink for IoT gateways. The embedded 12-bit ADC handles up to 17 analog channels, interfacing directly with temperature, pressure, and humidity sensors without external signal conditioning. Dual-configuration flash enables remote OTA upgrades with rollback on checksum failure - critical for unattended edge nodes in smart-building and smart-city deployments where physical access is impractical.
Recommended
Recommended Products Summary
Engineering reference data for 10M50DCF672I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M50DCF672C8G | 10M50DCF672C7G | 10M50DAF672I7G | 10M40DCF672I7G | 10M50DAF672C8G |
|---|---|---|---|---|---|---|
| Package | 672-ball FBGA (FineLine BGA) | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,000 | 50,000 | 50,000 | 50,000 | 40,000 (-20%) | 50,000 |
| Embedded Memory (bits) | 1,677,312 | 1,677,312 | 1,677,312 | 1,677,312 | 1,259,520 (-25%) | 1,677,312 |
| DSP Blocks (18x18) | 144 | 144 | 144 | 144 | 125 (-13%) | 144 |
| User I/Os | 500 | 500 | 500 | 500 | 500 | 500 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Automotive -40C to +125C | Industrial -40C to +100C | Automotive -40C to +125C |
| Speed Grade | 7 | 8 (faster) | 7 | 7 | 7 | 8 (faster) |
| Integrated ADC | 12-bit SAR, 1 MSPS, 17 channels | 12-bit SAR, 1 MSPS, 17 channels | 12-bit SAR, 1 MSPS, 17 channels | 12-bit SAR, 1 MSPS, 17 channels | 12-bit SAR, 1 MSPS, 16 channels | 12-bit SAR, 1 MSPS, 17 channels |
Key Differentiators
- Industrial temperature grade -40C to +100C with speed grade 7 timing (vs 10M50DCF672C8G)
- Highest-density option in MAX 10 family with 50K logic elements (vs 10M40DCF672I7G)
- On-chip dual-configuration flash enables instant-on without external boot PROM (vs Cyclone IV EP4CE40F672I7N (predecessor))
Design Notes
The 672-ball FineLine BGA requires a 1.0 mm ball pitch PCB land pattern with NSMD (non-solder mask defined) pads per the Intel MAX 10 hardware design guidelines. Use a 4-layer or 6-layer stack-up with continuous ground planes under the BGA for signal and power integrity. Estimate: at 8 mil via-in-pad microvia geometry, breakout routing of 500 I/Os requires at least 6 routing layers plus 2 dedicated power/ground planes. Apply via tenting on the BGA side to reduce solder wicking during reflow.
Although the MAX 10 fabric runs at 1.2 V and typically dissipates 1-2 W, integrated ADC conversions and high-toggle-rate I/Os can push junction temperatures higher in sealed enclosures. Estimate: with theta_JA around 18 C/W on a JEDEC 4-layer test board, a 2 W dissipation yields 36 C rise above ambient. For fanless industrial enclosures, recommend 4-layer board with continuous copper pour stitched to GND, and verify thermal headroom via the MAX 10 on-die temperature-sensing diode read by Quartus' PowerPlay thermal analyzer.
Do not assume all MAX 10 family members share identical pinout across packages - only F672 package variants (DCF672, DAF672) share the same 672-FBGA ball map. F484 and F256 packages use different pinout files and cannot be substituted at the PCB level. Verify the exact pinout file (.pin) in Quartus Prime Pin Planner before tape-out. Also confirm configuration mode (AS/PS/JTAG) is correctly selected by MSEL pins at board bring-up; incorrect MSEL settings cause silent configuration failure with no error indication.
LVDS signaling on the MAX 10 requires 100 ohm differential impedance traces with matched length (±10 mil) within each LVDS pair. The MAX 10 PLL output frequency must be within the device's PLL VCO range (typically 600-1300 MHz depending on speed grade) - check Quartus Prime fitter reports for PLL feedback-path timing closure. For DDR3 memory interfaces, follow the Intel External Memory Interface Handbook for the specific speed grade and use the on-chip hard memory controller.
Compliance Information
RoHS and REACH compliant per Intel/Altera product declaration. The I7G grade is industrial temperature qualified, not AEC-Q100 - select the 10M50DAF672I7G variant for automotive applications. Lead-free BGA balls comply with JEDEC J-STD-020 MSL-3 moisture sensitivity classification.
