5CGXBC5C7F27C8N vs 5CGXBC7B7M15C8N Comparison
Detailed side-by-side comparison of 5CGXBC5C7F27C8N by Intel and 5CGXBC7B7M15C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 5CGXBC5C7F27C8N | 5CGXBC7B7M15C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $54.18 | $149.00 |
| Family | Cyclone® V GX | Cyclone V GX (5CGXC7) |
| Logic Elements (LE) | 77,000 | 149,500 |
| Adaptive Logic Modules (ALM) | 29,080 | — |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) | — |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) | — |
| 18 × 18 Multipliers | 364 | — |
| PLLs | 6 | — |
| Global Clock Networks | 16 | — |
| Transceivers | 6 × 3.125 Gbps (GX) | Integrated 3.125 Gbps, up to 8 channels |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Maximum User I/O | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.1 V | — |
| Process Node | 28 nm TSMC low-power | — |
| Package | 672-pin FBGA (F27, 27 mm × 27 mm) | 484-ball LFBGA (MBGA), 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Operating Temperature | 0 °C to +85 °C (commercial, C8) | Commercial (0C to +85C) |
| Configuration | JTAG (IEEE 1149.1) + Active Serial | SRAM-based, supports AS / PS / JTAG |
| RoHS Status | Compliant | — |
| Embedded Memory | — | 7,880,704 bits |
| User I/O Pins | — | 240 |
| Speed Grade | — | C8 |
| Process Technology | — | TSMC 28 nm low-power |
| Hard PCIe IP | — | PCIe Gen2 x1/x2/x4 |
| Memory Controllers | — | 2 hard controllers, DDR3 up to 800 MHz |
| DSP Blocks | — | Variable-precision, 18x19 multipliers |
| Lead-Free / RoHS | — | Yes (N suffix) |