5CGXBC5C7F27C8N vs 5CGXBC7B7M15C8N Vergleich
Detaillierter Direktvergleich von 5CGXBC5C7F27C8N von Intel und 5CGXBC7B7M15C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 5CGXBC5C7F27C8N | 5CGXBC7B7M15C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $54,18 | $149,00 |
| Family | Cyclone® V GX | Cyclone V GX (5CGXC7) |
| Logic Elements (LE) | 77,000 | 149,500 |
| Adaptive Logic Modules (ALM) | 29,080 | — |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) | — |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) | — |
| 18 × 18 Multipliers | 364 | — |
| PLLs | 6 | — |
| Global Clock Networks | 16 | — |
| Transceivers | 6 × 3.125 Gbps (GX) | Integrated 3.125 Gbps, up to 8 channels |
| PCIe Hard IP | Yes (Gen1/Gen2) | — |
| Maximum User I/O | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.1 V | — |
| Process Node | 28 nm TSMC low-power | — |
| Gehäuse | 672-pin FBGA (F27, 27 mm × 27 mm) | 484-ball LFBGA (MBGA), 1.0 mm pitch |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Betriebstemperatur | 0 °C to +85 °C (commercial, C8) | Commercial (0C to +85C) |
| Configuration | JTAG (IEEE 1149.1) + Active Serial | SRAM-based, supports AS / PS / JTAG |
| RoHS-Status | Compliant | — |
| Embedded Memory | — | 7,880,704 bits |
| User I/O Pins | — | 240 |
| Speed Grade | — | C8 |
| Process Technology | — | TSMC 28 nm low-power |
| Hard PCIe IP | — | PCIe Gen2 x1/x2/x4 |
| Memory Controllers | — | 2 hard controllers, DDR3 up to 800 MHz |
| DSP Blocks | — | Variable-precision, 18x19 multipliers |
| Lead-Free / RoHS | — | Yes (N suffix) |