5CGXBC5C7F27C8N vs 5CGXBC9D6F27C7N Comparison

Detailed side-by-side comparison of 5CGXBC5C7F27C8N by Intel and 5CGXBC9D6F27C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CGXBC5C7F27C8N 5CGXBC9D6F27C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $54.18 $289.00
Family Cyclone® V GX Cyclone V GX
Logic Elements (LE) 77,000 —
Adaptive Logic Modules (ALM) 29,080 —
Total Embedded Memory 5,001,216 bits (4,884 Kbits usable) —
Embedded Memory Blocks (M10K + MLAB) 446 × M10K + 231 × MLAB (approx.) —
18 × 18 Multipliers 364 —
PLLs 6 —
Global Clock Networks 16 —
Transceivers 6 × 3.125 Gbps (GX) GX family transceivers (per package variant)
PCIe Hard IP Yes (Gen1/Gen2) Yes, Gen1/Gen2
Maximum User I/O [DATA_NEEDED: maximum user I/O count] —
Core Voltage 1.1 V 1.1 V
Process Node 28 nm TSMC low-power —
Package 672-pin FBGA (F27, 27 mm × 27 mm) 672-ball FBGA
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Operating Temperature 0 °C to +85 °C (commercial, C8) —
Configuration JTAG (IEEE 1149.1) + Active Serial —
RoHS Status Compliant Compliant
Logic Elements — 301,000
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
Embedded Memory — 14,251,008 bits
Memory Blocks (M20K) — [DATA_NEEDED: M20K count]
Embedded Multipliers (18x18) — 336
Transceiver Data Rate — Up to 3.125 Gbps
I/O Voltage Support — 1.2 V to 3.3 V (bank-dependent)
User I/O Pins — [DATA_NEEDED: user I/O count for FBGA-672]
Process Technology — 28 nm TSMC low-power
Speed/Grade — C7 (commercial, speed grade 7)
MSL Level — [DATA_NEEDED: MSL rating]

Datasheets & Resources

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