5CGXBC9D6F27C7N - Cyclone V GX FPGA, 301K LE, FBGA-672 | Intel
MPN: 5CGXBC9D6F27C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $415 | $415.00 |
| 10 | $387.5 | $3,875.00 |
| 100 | $352 | $35,200.00 |
| 500 | $318.75 | $159,375.00 |
| 1,000 | $289 | $289,000.00 |
Drop-in alternatives for 5CGXBC9D6F27C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CGXBC9D6F27C8N
✅ Drop-In📋 Reference alternative (not in catalog)
5CGXBC9D6F31C7N
✅ Drop-In📋 Reference alternative (not in catalog)
5CGXBC7D7F27C8N
✅ Drop-In✓ In Stock
$228.5 / Unit
View Datasheet →5CGXBC5C7F27C8N
✅ Drop-In✓ In Stock
$54.18 / Unit
View Datasheet →5CEFA9F27C7N
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →5CGXBC9D6F27C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V GX |
| Logic Elements | 301,000 |
| Embedded Memory | 14,251,008 bits |
| Embedded Multipliers (18x18) | 336 |
| Transceivers | GX family transceivers (per package variant) |
| Transceiver Data Rate | Up to 3.125 Gbps |
| PCIe Hard IP | Yes, Gen1/Gen2 |
| Core Voltage | 1.1 V |
| I/O Voltage Support | 1.2 V to 3.3 V (bank-dependent) |
| Process Technology | 28 nm TSMC low-power |
| Package | 672-ball FBGA |
| Speed/Grade | C7 (commercial, speed grade 7) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
5CGXBC9D6F27C7N 672-ball fbga Pin Configuration Guide
Complete pinout information for 5CGXBC9D6F27C7N (672-ball fbga package) with [DATA_NEEDED: user I/O count for FBGA-672] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC9D6F27C7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: user I/O count for FBGA-672] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC9D6F27C7N is suitable for 6 applications: Industrial Machine Vision and Factory Automation, Video Surveillance and Broadcast Video Processing, PCIe-Based Protocol Bridging Add-In Cards, Industrial Motor Control and Drive Interfaces, Low-Cost Wireline Communication Line Cards, Software-Defined Radio Front-End Processing.
Industrial Machine Vision and Factory Automation
The 5CGXBC9D6F27C7N's 301,000 logic elements and 336 hardware 18x18 multipliers provide ample DSP throughput for real-time image processing pipelines including Bayer demosaicing, edge detection, and object classification. Its integrated transceivers up to 3.125 Gbps enable CoaXPress, GigE Vision, and Camera Link HS camera interfaces, while the PCIe hard IP supports frame grabber host connectivity to industrial PCs. Industrial temperature support and high I/O count in the FBGA-672 package suit factory automation controllers requiring multi-protocol sensor aggregation.
Recommended
Video Surveillance and Broadcast Video Processing
The Cyclone V GX device's embedded memory (14.25 Mbits) provides frame buffer storage for multi-stream video processing, while 301K logic elements enable pipelined HD/UHD processing. Transceivers support SDI (Serial Digital Interface) at 270 Mbps to 2.97 Gbps via external PHY, and the PCIe hard IP enables host card integration for video analytics servers. The C7 commercial speed grade provides cost-optimized timing closure for standard-definition to high-definition broadcast pipelines.
Recommended
PCIe-Based Protocol Bridging Add-In Cards
The integrated PCIe Gen1/Gen2 hard IP block eliminates soft IP resource cost for PCIe endpoint and rootport designs, freeing logic for protocol conversion between PCIe and legacy buses (PCI, ISA, UART, I2C). With 6 transceiver channels and 301K logic elements, the 5CGXBC9D6F27C7N supports multi-protocol bridging add-in cards for industrial PCs and embedded platforms. The hard IP provides compliance-tested PCIe signalling, reducing certification risk for medical, industrial, and military bridge cards.
Recommended
Industrial Motor Control and Drive Interfaces
The 5CGXBC9D6F27C7N's 336 hardware multipliers accelerate field-oriented control (FOC) algorithms, PWM generation, and encoder interface logic for AC drives and servo controllers. The 1.1 V core with selectable I/O voltages supports direct interface to 3.3 V gate drivers and 5 V position sensors via level shifters. Hardened memory controllers interface directly to DDR3 external RAM for control loop data logging, while PCIe enables real-time Ethernet (EtherCAT, PROFINET) host connectivity to industrial drive networks.
Recommended
Low-Cost Wireline Communication Line Cards
With 6 transceivers up to 3.125 Gbps, the 5CGXBC9D6F27C7N supports CPRI, OBSAI, SGMII, and custom serial interfaces for small-cell baseband units and access network line cards. The hard memory controller interfaces to DDR3 for protocol buffer memory, while 301K logic elements enable soft-core CPU subsystems (Nios II) for protocol stack offload. PCIe hard IP allows direct connection to baseband SoCs over standard high-speed serial links, reducing board complexity and BOM cost.
Recommended
Software-Defined Radio Front-End Processing
The Cyclone V GX's transceivers digitize RF signals from ADCs like the AD9680 in direct-conversion or super-heterodyne SDR architectures, while 301K logic elements implement digital down-conversion (DDC), channelization filters, and modulation/demodulation in firmware-reconfigurable logic. The 336 hardware multipliers enable wideband FFTs and pulse-shaping filters, while PCIe hard IP streams processed IQ data to host processors for protocol decoding. The C7 speed grade and industrial temperature support suit tactical and commercial SDR platforms.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC9D6F27C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC9D6F27C8N | 5CGXBC9D6F31C7N | 5CGXBC7D7F27C8N | 5CGXBC5C7F27C8N | 5CEFA9F27C7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-672 | FBGA-672 (same) | FBGA-896 (larger) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) |
| Logic Elements | 301,000 | 301,000 | 301,000 | 149,500 | 77,000 | 301,000 |
| Embedded Memory (bits) | 14,251,008 | 14,251,008 | 14,251,008 | 6,858,624 | 4,132,608 | 14,251,008 |
| 18x18 Multipliers | 336 | 336 | 336 | 156 | 96 | 336 |
| Transceivers | 6 (3.125 Gbps max) | 6 (3.125 Gbps max) | 9 (3.125 Gbps max) | 6 (3.125 Gbps max) | 6 (3.125 Gbps max) | None (E family, no transceivers) |
| PCIe Hard IP | Yes (Gen1/Gen2) | Yes (Gen1/Gen2) | Yes (Gen1/Gen2) | Yes (Gen1/Gen2) | Yes (Gen1/Gen2) | No (E family) |
| Speed Grade | C7 | C8 | C7 | C8 | C8 | C7 |
| Single-Unit Price (USD, approx.) | $415 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Cost-optimized high-density Cyclone V GX option (vs 5CGXBC7D7F27C8N)
- Integrated multi-gigabit transceivers eliminate external PHY cost (vs 5CEFA9F27C7N)
- C7 commercial speed grade offers best cost-vs-performance balance (vs 5CGXBC9D6F27C8N)
Design Notes
The 672-ball FBGA package uses 1.0 mm ball pitch, which requires microvia-compatible PCB stackups (typically 4-6 mil laser-drilled vias in the BGA fanout region). Designers should follow Intel's Cyclone V device family pin connection guidelines and use the provided .bxl board files for schematic symbol and footprint generation. Maintain continuous ground planes beneath the BGA and provide adequate thermal vias (0.3 mm diameter, 1.2 mm pitch) for the exposed-die thermal pad. Decoupling per Intel's PDN (Power Distribution Network) guideline: 1x 10 uF bulk + 4x 0.1 uF per VCC supply pin.
Estimated: at typical industrial operating conditions (25C ambient, 1.1 V core, 50% logic utilization, 50% toggle rate), the 5CGXBC9D6F27C7N dissipates approximately 2-4 W. The FBGA-672 package has a theta_JA of approximately 12 C/W with a JEDEC-compliant 4-layer test board and adequate thermal vias, resulting in a junction temperature rise of 24-48 C above ambient. For designs exceeding 4 W or operating above 70C ambient, attach a heatsink or use forced airflow. Always validate via Intel's PowerPlay early power estimator before PCB layout commitment.
Common pitfalls with the 5CGXBC9D6F27C7N include: (1) failing to assign transceiver reference clock pins per the pin connection guidelines, leading to link failure; (2) omitting the dedicated PCIe reference clock input, which violates PCIe compliance; (3) using LVDS without proper external termination resistors - Cyclone V requires 100 ohm near-end termination; (4) configuring MSEL pins incorrectly for the desired configuration mode (AS/PS/FPP/JTAG); (5) not validating pin assignments against the Quartus II fitter before PCB fabrication. Reference Intel AN 584 (Cyclone V transceiver design guidelines) for serial-interface best practices.
Compliance Information
RoHS and REACH compliance per Intel Cyclone V product environmental declaration. Lead-free SAC305 BGA finish. Not AEC-Q100 qualified - automotive applications should evaluate automotive-suffix Cyclone V variants or alternative FPGA families. Halogen-free per Intel's standard product policy.
