5CGXBC5C7F27C8N vs 5CGXBC9D6F27C7N 비교
다음의 상세 나란히 비교: 5CGXBC5C7F27C8N 제조: Intel 및 5CGXBC9D6F27C7N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 5CGXBC5C7F27C8N | 5CGXBC9D6F27C7N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $54.18 | $289.00 |
| Family | Cyclone® V GX | Cyclone V GX |
| Logic Elements (LE) | 77,000 | — |
| Adaptive Logic Modules (ALM) | 29,080 | — |
| Total Embedded Memory | 5,001,216 bits (4,884 Kbits usable) | — |
| Embedded Memory Blocks (M10K + MLAB) | 446 × M10K + 231 × MLAB (approx.) | — |
| 18 × 18 Multipliers | 364 | — |
| PLLs | 6 | — |
| Global Clock Networks | 16 | — |
| Transceivers | 6 × 3.125 Gbps (GX) | GX family transceivers (per package variant) |
| PCIe Hard IP | Yes (Gen1/Gen2) | Yes, Gen1/Gen2 |
| Maximum User I/O | [DATA_NEEDED: maximum user I/O count] | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Node | 28 nm TSMC low-power | — |
| 패키지 | 672-pin FBGA (F27, 27 mm × 27 mm) | 672-ball FBGA |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| 동작 온도 | 0 °C to +85 °C (commercial, C8) | — |
| Configuration | JTAG (IEEE 1149.1) + Active Serial | — |
| RoHS 상태 | Compliant | Compliant |
| Logic Elements | — | 301,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 14,251,008 bits |
| Memory Blocks (M20K) | — | [DATA_NEEDED: M20K count] |
| Embedded Multipliers (18x18) | — | 336 |
| Transceiver Data Rate | — | Up to 3.125 Gbps |
| I/O Voltage Support | — | 1.2 V to 3.3 V (bank-dependent) |
| User I/O Pins | — | [DATA_NEEDED: user I/O count for FBGA-672] |
| Process Technology | — | 28 nm TSMC low-power |
| Speed/Grade | — | C7 (commercial, speed grade 7) |
| MSL 레벨 | — | [DATA_NEEDED: MSL rating] |