5CSEBA5U19A7N vs 5CSEBA5U19C7N Comparison

Detailed side-by-side comparison of 5CSEBA5U19A7N by Intel and 5CSEBA5U19C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CSEBA5U19A7N 5CSEBA5U19C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $152.40 $99.20
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 85,000 85,000
Process Technology 28 nm low-power —
Hard Processor System (HPS) Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Frequency 700 MHz 800 MHz per core
Package 484-pin UBG A (19x19 mm) 484-UBGA (UBGAmobile, 19x19 mm)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Supply Voltage (Core) 1.1 V 1.1 V typical
Operating Temperature Grade Automotive (AEC-Q100) -40C to +125C —
I/O Count 66 (per source listing) —
Memory Interface DDR3 controller in HPS; external memory interface in FPGA fabric —
DSP Blocks Variable-precision DSP blocks Variable-precision, 18x18 / 27x27 multipliers
Configuration / Boot Modes NAND, QSPI, SD/MMC —
RoHS Status Compliant (per Ampheo listing) —
Automotive Qualification AEC-Q100 (Automotive grade, indicated by 'A' in part number) —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Operating Temperature — 0C to +85C (commercial, junction)
Speed Grade — -7 (standard)
Process Node — 28 nm low-power (TSMC)
Embedded Memory — M10K + MLAB blocks, ~4,450 Kbits total
HPS Peripherals — EMAC, USB 2.0 OTG, NAND, DDR3, SPI, QSPI, I2C, UART
RoHS / Pb-free — Yes
Configuration Memory — External (active serial via HPS or FPGA)
MSL Level — 3 (per JEDEC J-STD-020, reflow 260C)
Block Pins (User I/O) — Approximately 66 user I/O pins

Datasheets & Resources

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