5CSEBA5U19C7N - Cyclone V SE SoC FPGA 85K LE Dual A9 800MHz | Altera
MPN: 5CSEBA5U19C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $143.46 | $143.46 |
| 10 | $132.1 | $1,321.00 |
| 100 | $115.75 | $11,575.00 |
| 250 | $108.4 | $27,100.00 |
| 500 | $99.2 | $49,600.00 |
5CSEBA5U19C7N Overview
What is a Cyclone V SE SoC FPGA? An SoC FPGA combines a hardened ARM Cortex-A9 application processor subsystem with programmable logic on the same silicon, occupying the hybrid position between a traditional microcontroller (fixed peripherals, deterministic) and a pure FPGA (fully programmable fabric, no native application CPU). In the system hierarchy it sits above discrete microcontrollers (more integration, more parallel compute) and below ASICs (less NRE cost, more flexibility). The Cyclone V family is built on TSMC's 28 nm low-power process and is the mainstream Altera/Intel SoC line, optimized for power-sensitive embedded designs.
The 5CSEBA5U19C7N delivers up to 85K logic elements, roughly 4,450 Kbits of embedded memory, and variable-precision DSP blocks supporting 18x18 and 27x27 multipliers for fixed- and floating-point workloads. The HPS includes dual Cortex-A9 cores with NEON media engine, single- and double-precision FPU, L1 cache per core, 512 KB shared L2, and a rich peripheral set including EMAC, USB 2.0 OTG, NAND flash controller, DDR3 controller, and SPI/QSPI/I2C/UART interfaces. Together these resources enable industrial motor control, video processing pipelines, and software-defined radio baseband blocks.
The 5CSEBA5U19C7N variant is specified for the commercial temperature grade (0C to +85C junction), uses the standard-speed -7 speed grade, and is Pb-free / RoHS compliant. Compared with the lower-density 5CSEBA4U19C7N, the 5CSEBA5 variant provides additional FPGA logic, more DSP blocks, and more M10K memory blocks for designers who need additional parallel compute or buffering headroom while keeping the same 484-UBGA footprint and pinout.
Typical applications include industrial machine vision cameras, factory automation controllers, automotive infotainment prototypes (commercial-grade variant for development), motor drives, and software-defined radio modems. The shared 484-UBGA 19x19 mm package keeps board layout compatible across the 5CSEBA5/4/2 density steps and across -C7 / -C8 / -I7 speed/temperature grades, simplifying platform reuse across product variants.
Drop-in alternatives for 5CSEBA5U19C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CSEBA5U19C7N (same form factor and footprint) — differing in Package, DSP Blocks, Embedded Memory, Logic Elements, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA5U19I7N
✅ Drop-In✓ In Stock
$119.85 / Unit
View Datasheet →5CSEBA5U19C8N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →5CSEBA5U19C6N
✅ Drop-In✓ In Stock
$118.2 / Unit
View Datasheet →5CSEBA5U19A7N
✅ Drop-In✓ In Stock
$152.4 / Unit
View Datasheet →XC7Z020-1CLG484C
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA5U19C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 85,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz per core |
| Package | 484-UBGA (UBGAmobile, 19x19 mm) |
| Operating Temperature | 0C to +85C (commercial, junction) |
| Speed Grade | -7 (standard) |
| Process Node | 28 nm low-power (TSMC) |
| Supply Voltage (Core) | 1.1 V typical |
| DSP Blocks | Variable-precision, 18x18 / 27x27 multipliers |
| Embedded Memory | M10K + MLAB blocks, ~4,450 Kbits total |
| HPS Peripherals | EMAC, USB 2.0 OTG, NAND, DDR3, SPI, QSPI, I2C, UART |
| Mounting Type | Surface Mount (BGA) |
| RoHS / Pb-free | Yes |
| Configuration Memory | External (active serial via HPS or FPGA) |
| MSL Level | 3 (per JEDEC J-STD-020, reflow 260C) |
| Block Pins (User I/O) | Approximately 66 user I/O pins |
5CSEBA5U19C7N 484-ubga (ubgamobile, 19x19 mm) Pin Configuration Guide
Pin configuration for 5CSEBA5U19C7N (484-ubga (ubgamobile, 19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA5U19C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
5CSEBA5U19C7N is suitable for 6 applications: Industrial Machine Vision Camera, Factory Automation PLC Controller, Software Defined Radio Modem, Motor Drive and Servo Controller, Medical Diagnostic Imaging Front-End, Automotive Infotainment Prototyping.
Industrial Machine Vision Camera
The 5CSEBA5U19C7N's 85K logic elements, variable-precision DSP blocks, and dual ARM Cortex-A9 HPS at 800 MHz make it a strong fit for industrial machine vision cameras that need on-sensor image preprocessing plus network connectivity. The FPGA fabric implements Bayer-to-RGB demosaic, lens distortion correction, and HDR merging pipelines at sensor line rate, while the Cortex-A9 runs Linux for GigE Vision / USB3 Vision protocol stacks and triggers. The 484-UBGA package's high pin count provides sufficient LVDS/MIPI lanes for high-speed image sensor interfaces, and the commercial temperature grade (0C to +85C junction) covers factory-floor enclosures with adequate derating. Unlike a pure CPU approach, this SoC FPGA eliminates the latency of host round-trips, enabling real-time inline inspection at conveyor speeds.
Recommended
Factory Automation PLC Controller
The 5CSEBA5U19C7N is well suited to factory automation PLC and PAC designs that must execute deterministic control loops alongside HMI and network protocols. The Cortex-A9 HPS runs Linux for OPC UA, MQTT, and web-based HMI while the FPGA fabric implements deterministic EtherCAT, PROFINET, or EtherNet/IP slave controllers with sub-microsecond jitter. With 85K logic elements, designers can instantiate multiple industrial Ethernet slaves plus custom high-speed counters and PWM generators in parallel. The 484-UBGA 19x19 mm package keeps the controller footprint compact enough for DIN-rail mounted modular PLCs, and the dual-core HPS provides ample headroom for code execution and OS scheduling under industrial workloads.
Recommended
Software Defined Radio Modem
The 5CSEBA5U19C7N is a natural fit for software defined radio baseband processing where flexibility, DSP throughput, and Linux-based control are all required. The variable-precision DSP blocks accelerate FFT, channelization, and modulation/demodulation while the dual Cortex-A9 HPS handles MAC-layer protocols, timing synchronization, and remote management. Compared to a pure FPGA, this SoC eliminates the need for an external MCU or hard CPU, reducing BOM cost and PCB area. The commercial temperature grade (0C to +85C) suits indoor and outdoor SDR enclosures, while the 484-UBGA package provides sufficient GPIO and HPS peripheral bandwidth for control-plane I/O. Designers can pair this part with a Cyclone V GT (5CGTFD) variant when transceivers are required.
Recommended
Motor Drive and Servo Controller
The 5CSEBA5U19C7N integrates the FPGA fabric needed for multi-axis field-oriented control (FOC) loops with the Linux-running HPS for motion orchestration, making it ideal for industrial servo and variable-frequency motor drives. Each FOC axis requires PWM, ADC sampling, and Park/Clarke transforms that the variable-precision DSP blocks execute at sub-microsecond latency, while the HPS runs the higher-level motion profile, trajectory planner, and EtherCAT master. The 85K logic elements accommodate four to six axes in a single device. The 484-UBGA package's high pin count provides dedicated pins for encoder interfaces, gate driver PWMs, and current sense ADCs, while the commercial temperature grade suits cabinet-mounted drives with proper thermal design.
Recommended
Medical Diagnostic Imaging Front-End
The 5CSEBA5U19C7N's combination of FPGA DSP and dual Cortex-A9 HPS enables portable medical imaging front-ends such as ultrasound beamformers and patient monitoring aggregation hubs. The FPGA fabric implements channel-level beamforming, FIR filtering, and envelope detection in real time, while the HPS runs Linux for DICOM, USB, and Wi-Fi connectivity plus the user interface. The 85K logic elements can support 32 to 64 ultrasound channels, and the variable-precision DSP blocks handle the multiplications per sample needed for beamformed pixel reconstruction. The commercial temperature grade is appropriate for clinical environments; the 484-UBGA package's compact 19x19 mm footprint enables handheld probe designs.
Recommended
Automotive Infotainment Prototyping
The 5CSEBA5U19C7N (commercial grade) is widely used by Tier-1 suppliers and OEMs to prototype next-generation automotive infotainment systems before committing to AEC-Q100 qualified parts. The dual Cortex-A9 HPS runs Android or Linux for HMI, navigation, and media, while the FPGA fabric implements custom video processing, CAN-FD gateways, and LVDS display bridges. With 85K logic elements and DDR3 memory bandwidth, the SoC handles multi-stream 1080p video compositing. The 484-UBGA package is compatible with the 5CSEBA5U19A7N (automotive temperature grade -40C to +125C junction), so a single PCB layout can be used for development (commercial part) and production (automotive part).
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U19C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U19I7N | 5CSEBA5U19C8N | 5CSEBA5U19C6N | 5CSEBA5U19A7N | XC7Z020-1CLG484C |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Xilinx (AMD) |
| Package | 484-UBGA (19x19) | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-FBGA (CLG484) - same pin count |
| Logic Elements | 85,000 | 85,000 | 85,000 | 85,000 | 85,000 | ~85,000 |
| HPS | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 800 MHz | Dual Cortex-A9 @ 667 MHz |
| Speed Grade | -7 (standard) | -7 | -8 (faster) | -6 (slower) | -7 | -1 (standard) |
| Temperature Grade | Commercial (0C to +85C) | Industrial (0C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Commercial (0C to +85C) |
| Process Node | 28 nm low-power | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
| Approx. Unit Price (qty 1, as of 2026-09-06) | $143.46 | Higher (industrial grade premium) | Higher (faster speed grade) | Lower (slower speed grade) | Highest (automotive grade) | Comparable |
| Toolchain | Intel Quartus Prime + SoC EDS | Quartus Prime + SoC EDS | Quartus Prime + SoC EDS | Quartus Prime + SoC EDS | Quartus Prime + SoC EDS | Xilinx Vivado + PetaLinux |
Key Differentiators
- Higher density within the same 484-UBGA footprint family (vs 5CSEBA4U19C7N)
- Cyclone V SE includes dual ARM Cortex-A9 HPS with full peripheral set (vs XC7Z020-1CLG484C)
- Industrial-grade drop-in alternative available (vs 5CSEBA5U19I7N)
Design Notes
The 484-UBGA package dissipates significant heat under sustained HPS + FPGA workloads. Estimated: at 1.2 W typical HPS load plus 3-5 W FPGA fabric utilization, total device power can reach 5-7 W, requiring a thermal pad connected to an inner copper pour with thermal vias to backside copper. The commercial temperature grade (0C to +85C junction) assumes proper thermal design; neglect this and the silicon will throttle or fail. Refer to the Cyclone V SoC Device Design Guidelines for PCB thermal layout examples.
The 484-UBGA's 1.0 mm ball pitch requires laser-drilled microvias or 0.4 mm via-in-pad technology for fanout. Use a 4-layer to 6-layer stack-up with continuous ground planes under the device to provide return paths for DDR3 and HPS peripherals. Place 100 nF decoupling capacitors within 1 mm of every VCC pin and bulk 47 uF capacitors at the board-level voltage rails. Avoid routing signal traces directly beneath the BGA; use the inner layers for fanout only.
When migrating from 5CSEBA4U19C7N (40K LE) to 5CSEBA5U19C7N (85K LE), recompile in Quartus Prime rather than using the bitstream directly - the pinout is identical but the FPGA image differs. For production, always source from authorized distributors to avoid counterfeit parts; independently tested clones of Altera Cyclone V devices are common on the gray market and may fail configuration or have corrupted embedded memory.
The HPS DDR3 controller runs at up to 533 MHz with matched-length fly-by topology. Use 100-ohm differential impedance for the DDR3 address/command traces, maintain length matching within +/-25 mils on data byte lanes, and place series terminations as recommended by the Cyclone V HPS External Memory Interface handbook. Failing to follow these guidelines will cause intermittent DDR3 training failures under temperature or voltage variation, particularly at the commercial-grade temperature extreme.
Cyclone V SoC FPGAs require multiple rails: 1.1 V core, 1.8 V or 2.5 V HPS I/O, 1.5 V DDR3, 3.3 V FPGA I/O, and 1.8 V configuration. Estimated: total current draw under full HPS + fabric load can reach 3-5 A on the 1.1 V rail alone; use a multi-phase synchronous buck regulator such as the TI TPS54331 or LTM4623 with sufficient bulk capacitance (>= 220 uF polymer) to handle load transients from FPGA logic activity spikes.
Compliance Information
RoHS and Pb-free confirmed from Intel product page. Commercial temperature grade is not AEC-Q100 qualified - use the 5CSEBA5U19A7N automotive variant for AEC-Q100. Halogen-free status not explicitly stated in web data.
