5CSEBA5U19C7N vs 5CSEBA5U19A7N Comparison

Detailed side-by-side comparison of 5CSEBA5U19C7N by Intel and 5CSEBA5U19A7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 5CSEBA5U19C7N 5CSEBA5U19A7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $99.20 $152.40
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 85,000 85,000
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Frequency 800 MHz per core 700 MHz
Package 484-UBGA (UBGAmobile, 19x19 mm) 484-pin UBG A (19x19 mm)
Operating Temperature 0C to +85C (commercial, junction) —
Speed Grade -7 (standard) —
Process Node 28 nm low-power (TSMC) —
Supply Voltage (Core) 1.1 V typical 1.1 V
DSP Blocks Variable-precision, 18x18 / 27x27 multipliers Variable-precision DSP blocks
Embedded Memory M10K + MLAB blocks, ~4,450 Kbits total —
HPS Peripherals EMAC, USB 2.0 OTG, NAND, DDR3, SPI, QSPI, I2C, UART —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS / Pb-free Yes —
Configuration Memory External (active serial via HPS or FPGA) —
MSL Level 3 (per JEDEC J-STD-020, reflow 260C) —
Block Pins (User I/O) Approximately 66 user I/O pins —
Process Technology — 28 nm low-power
Hard Processor System (HPS) — Dual ARM Cortex-A9 MPCore with CoreSight
Operating Temperature Grade — Automotive (AEC-Q100) -40C to +125C
I/O Count — 66 (per source listing)
Memory Interface — DDR3 controller in HPS; external memory interface in FPGA fabric
Configuration / Boot Modes — NAND, QSPI, SD/MMC
RoHS Status — Compliant (per Ampheo listing)
Automotive Qualification — AEC-Q100 (Automotive grade, indicated by 'A' in part number)

Datasheets & Resources

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