5CSEBA5U19C7N vs 5CSEBA5U19A7N Vergleich

Detaillierter Direktvergleich von 5CSEBA5U19C7N von Intel und 5CSEBA5U19A7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 5CSEBA5U19C7N 5CSEBA5U19A7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $99,20 $152,40
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 85,000 85,000
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Frequency 800 MHz per core 700 MHz
Gehäuse 484-UBGA (UBGAmobile, 19x19 mm) 484-pin UBG A (19x19 mm)
Betriebstemperatur 0C to +85C (commercial, junction) —
Speed Grade -7 (standard) —
Process Node 28 nm low-power (TSMC) —
Supply Voltage (Core) 1.1 V typical 1.1 V
DSP Blocks Variable-precision, 18x18 / 27x27 multipliers Variable-precision DSP blocks
Embedded Memory M10K + MLAB blocks, ~4,450 Kbits total —
HPS Peripherals EMAC, USB 2.0 OTG, NAND, DDR3, SPI, QSPI, I2C, UART —
Montageart Surface Mount (BGA) Surface Mount (BGA)
RoHS / Pb-free Yes —
Configuration Memory External (active serial via HPS or FPGA) —
MSL-Level 3 (per JEDEC J-STD-020, reflow 260C) —
Block Pins (User I/O) Approximately 66 user I/O pins —
Process Technology — 28 nm low-power
Hard Processor System (HPS) — Dual ARM Cortex-A9 MPCore with CoreSight
Operating Temperature Grade — Automotive (AEC-Q100) -40C to +125C
I/O Count — 66 (per source listing)
Memory Interface — DDR3 controller in HPS; external memory interface in FPGA fabric
Configuration / Boot Modes — NAND, QSPI, SD/MMC
RoHS-Status — Compliant (per Ampheo listing)
Automotive Qualification — AEC-Q100 (Automotive grade, indicated by 'A' in part number)

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