A3P600-1FGG484 vs A3PE600-1FGG484 Comparison
Detailed side-by-side comparison of A3P600-1FGG484 by Microchip Technology and A3PE600-1FGG484 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
A3P600-1FGG484 - 600K Gate ProASIC3 FPGA, 235 I/O | Microchip
A3P600-1FGG484 ✓ ActiveMicrochip Technology
A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
A3PE600-1FGG484 ✓ ActiveSpecification Comparison
| Parameter | A3P600-1FGG484 | A3PE600-1FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $52.40 | $44.90 |
| Family | ProASIC3 | ProASIC3E |
| System Gates | 600,000 | 600000 |
| Logic Elements / VersaTiles | 13824 | — |
| User I/O | 235 | — |
| Embedded Memory | 110592 | — |
| Maximum System Frequency | 272 MHz | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm CMOS flash | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Speed Grade | -1 | -1 |
| Configuration Memory | Nonvolatile flash (single chip) | On-chip flash, live at power-up (Level 0) |
| I/O Banks | 4 | — |
| Package | 484-ball FBGA (FGG484) | 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | [DATA_NEEDED: Operating Temperature Range] | 0 C to +85 C (TJ) |
| RoHS Status | Compliant | ROHS3 Compliant |
| Design Software | Microchip Libero SoC | — |
| Packaging | Tray | Tray |
| Logic Cells / CLBs | — | 13824 |
| User I/Os (this package) | — | 270 |
| Max User I/Os (family) | — | 616 |
| Embedded SRAM | — | 110592 bits (504 kbits true dual-port max per family data) |
| Core Supply Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Product Status | — | Active |
| Manufacturer Lead Time | — | 8 weeks |
| Reprogrammability | — | Yes, single-chip solution, no external boot device |