A3PE600-1FGG484 - 600K Gate Flash FPGA 484-FBGA | Microchip
MPN: A3PE600-1FGG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.1 | $621.00 |
| 100 | $55.4 | $5,540.00 |
| 500 | $49.8 | $24,900.00 |
| 1,000 | $44.9 | $44,900.00 |
Drop-in alternatives for A3PE600-1FGG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE600-1FGG484I
✅ Drop-In✓ In Stock
$42.4 / Unit
View Datasheet →A3PE600-FGG484
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View Datasheet →A3PE600-FGG484I
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$44.03 / Unit
View Datasheet →A3PE600-FG484
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$59 / Unit
View Datasheet →A3PE600-FG484I
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View Datasheet →A3PE600-2FG484
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View Datasheet →A3PE600-1FGG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| System Gates | 600000 |
| Logic Cells / CLBs | 13824 |
| User I/Os (this package) | 270 |
| Max User I/Os (family) | 616 |
| Embedded SRAM | 110592 bits (504 kbits true dual-port max per family data) |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | On-chip flash, live at power-up (Level 0) |
| Speed Grade | -1 |
| Operating Temperature | 0 C to +85 C (TJ) |
| Package | 484-FPBGA (FBGA-484), 23 x 23 mm, 1 mm pitch |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| RoHS Status | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
| Reprogrammability | Yes, single-chip solution, no external boot device |
A3PE600-1FGG484 484-fpbga (fbga-484), 23 x 23 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for A3PE600-1FGG484 (484-fpbga (fbga-484), 23 x 23 mm, 1 mm pitch package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600-1FGG484.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE600-1FGG484 is suitable for 6 applications: Industrial Control and Automation, Aerospace and Defense Subsystems, Communications Line Cards, Test and Measurement Instrumentation, Secure Single-Chip Embedded Systems, Prototyping and Low-Volume Production.
Industrial Control and Automation
The A3PE600-1FGG484's 600K gates and 270 user I/Os make it well suited to industrial control cards handling motor sequencing, sensor aggregation, and protocol bridging between field buses and backplanes. Flash configuration gives live-at-power-up behavior, so interlocks and safety logic are active the instant 1.5V and I/O rails settle, with no boot-loader delay as in SRAM FPGAs. The 504 kbits of true dual-port SRAM buffer FIFO traffic between subsystems. Place the FPGA between a microcontroller and high-density I/O, using its parallel fabric for deterministic timing; the trade-off is that complex DSP algorithms need external support since the 130-nm ProASIC3E fabric lacks hardened multipliers at ProASIC3E-class density.
Recommended
Aerospace and Defense Subsystems
Flash-based ProASIC3E devices are widely used in aerospace and defense because configuration resides in on-chip flash rather than an external bitstream SRAM, reducing readback attack surface and eliminating configuration PROM parts that add BOM and reliability concerns. The A3PE600-1FGG484 provides 600K gates for telemetry framing, bus interfaces, and glue logic on avionics line-replaceable units. Single-chip, live-at-power-up operation simplifies power sequencing qualification. Note the commercial 0C to +85C rating: for extended-temperature programs specify the A3PE600-1FGG484I industrial variant on the same footprint, and apply Microchip's radiation and screening data separately since this listing covers the commercial flow only.
Recommended
Communications Line Cards
In networking and telecom line cards, the A3PE600-1FGG484 aggregates framer, PHY, and backplane interfaces: 270 user I/Os cover multiple parallel LVCMOS banks, and 110592 bits of embedded dual-port SRAM implement per-channel FIFOs. Flash configuration removes the serial configuration flash from the BOM, reducing bring-up complexity in hot-swap shelves where cards must be ready immediately after insertion. The -1 speed grade supports clock rates typical of 130-nm-era line-card control planes (tens to low hundreds of MHz); verify timing closure in Libero SoC, and step up to the pin-compatible A3PE600-2FG484 (-2 grade) if paths fail, without PCB redesign.
Recommended
Test and Measurement Instrumentation
Bench instruments and ATE modules use the A3PE600-1FGG484 as a flexible timing, trigger, and routing fabric. The 13,824 CLBs implement counter/timer arrays, trigger state machines, and parallel register banks with deterministic delays, while true dual-port SRAM captures waveform segments locally. Live-at-power-up flash configuration means the instrument front-end is controllable before software loads - valuable for self-test at boot. Designers should reserve I/O banks for clock-capable inputs and keep trigger paths on the shortest routing; if measured skew exceeds budget, migrating to the pin-compatible -2 speed grade closes timing without layout changes, at a modest cost premium.
Recommended
Secure Single-Chip Embedded Systems
Because the ProASIC3E bitstream is stored in on-chip flash with no external configuration device, the A3PE600-1FGG484 suits secure embedded controllers where bitstream interception during boot is a threat model. There is no configuration readback bus traffic, and the system presents fewer tamper surfaces than SRAM FPGA designs with boot PROMs. The 600K gates implement custom peripherals, crypto glue logic, and anti-cloning checks around a host processor. Designers should complement the flash FPGA with secure key storage off-chip, and note that physical-security requirements beyond configuration confidentiality (e.g., side-channel hardening) must be addressed at the system level, not by the fabric alone.
Recommended
Prototyping and Low-Volume Production
The A3PE600-1FGG484 is a strong fit for prototyping and low-volume products: single-chip flash configuration removes the cost and footprint of a configuration flash, and reprogrammability lets teams iterate without board spins. Total cost of ownership is lower than SRAM FPGA alternatives at this density because the boot device, its associated rail, and assembly steps disappear. The tray packaging suits prototype and small-batch builds; the same die is offered in smaller 256-ball FBGA and 208-pin QG packages (e.g., A3PE600-2FG256, A3PE600-PQG208I) for cost-optimized volume products, though those are not pin-compatible with the 484-ball footprint.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600-1FGG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600-1FGG484I | A3PE600-FGG484 | A3PE600-FGG484I | A3PE600-FG484 |
|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm, 1 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/Os | 270 | 270 | 270 | 270 | 270 |
| Speed Grade | -1 | -1 | standard (no -1 suffix) | standard (no -1 suffix) | standard (no -1 suffix) |
| Operating Temperature | 0C to +85C (TJ) | -40C to +100C (industrial) | 0C to +85C (TJ) | -40C to +100C (industrial) | 0C to +85C (TJ) |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| RoHS Status | ROHS3 Compliant | RoHS compliant (I suffix, industrial) | RoHS compliant (green package) | RoHS compliant (green package) | RoHS compliant |
Key Differentiators
- Live-at-power-up flash configuration, no external boot device (vs A3PE600-FGG484 (equivalent flash behavior) / SRAM FPGAs generally)
- Industrial-temperature drop-in available on the identical footprint (vs A3PE600-1FGG484I)
- Honest trade-off: no hardened DSP/multiplier blocks (vs Xilinx/Altera SRAM FPGAs (e.g., Artix-class))
Design Notes
The A3PE600-1FGG484 requires a 1.5V core rail within 1.425V to 1.575V plus independent I/O bank rails. Estimated: static flash-FPGA current is low relative to SRAM FPGAs, but dynamic current scales with clock frequency and toggle rate - budget the core regulator (e.g., 1.5V/1 A class) using Libero SoC power-analysis results at your actual utilization, not a generic estimate. Power rails up before configuration is unnecessary since the fabric is live at power-up, but ensure rail monotonicity per the ProASIC3E family datasheet power-up requirements.
For the 23 x 23 mm, 1 mm-pitch 484-ball FBGA, fan out with via-in-pad or dog-bone escapes on an 8-layer stack (minimum 6 layers for 270 used I/Os). Follow the ProASIC3E datasheet decoupling guidance: place bulk capacitance near each VCC/VCCI bank and 0.1 uF ceramics within a few millimeters of power balls. The center region of the footprint carries power/ground balls - use it for the plane connectivity and escape only signal balls from the perimeter rows.
Verify speed grade before release: the -1 grade is slower than -2, and designs that close timing on a -2 sample may fail on -1 silicon. Re-run Libero SoC timing at -1 with your placement. Also, do not assume industrial temperature: this commercial part is rated 0C to +85C (TJ); if your environment reaches -40C, substitute the pin-identical A3PE600-1FGG484I. Finally, programming requires a Microchip FlashPro programmer via JTAG - plan the header footprint accordingly.
Compliance Information
ROHS3 Compliant per Microchip USA listing; PCB Electronics listing notes LEAD FREE. REACH, halogen-free, and conflict-minerals declarations not found in provided data - request certificates from Microchip compliance portal.
