A3PE3000L-1FG484 vs A3PE3000L-1FG484I Comparison

Detailed side-by-side comparison of A3PE3000L-1FG484 by Microchip Technology and A3PE3000L-1FG484I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3PE3000L-1FG484 A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip

A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip

A3PE3000L-1FG484 ✓ Active
Microchip Technology
A3PE3000L-1FG484I A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip

A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip

A3PE3000L-1FG484I ✓ Active

Specification Comparison

Parameter A3PE3000L-1FG484 A3PE3000L-1FG484I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $280.54 $89.90
Family ProASIC3L (Flash FPGA) ProASIC3L (Low Power Flash FPGA)
System Gates 3000000 3,000,000 gates
Logic Cells / CLBs 75264 —
Logic Elements (LEs) [DATA_NEEDED: LE count] 35 KLEs
User I/O 341 —
Embedded Memory 516096 bits —
Core Voltage 1.2 V to 1.5 V 1.2 V (family supports 1.2 V to 1.5 V)
Speed Grade -1 -1
Package 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch 484-ball FBGA (FG484)
Mounting Type Surface Mount Surface Mount
Configuration Technology Flash (non-volatile, single-chip) —
Special Features Flash*Freeze technology, live reprogrammability Flash*Freeze technology, non-volatile single-chip
RoHS Status Non-Compliant (standard grade; see -FGG484 / M / I variants for compliant options) [DATA_NEEDED: RoHS compliance status]
Operating Temperature [DATA_NEEDED: operating temperature range] [DATA_NEEDED: exact min/max operating temperature range]
Supply Voltage - I/O [DATA_NEEDED: I/O voltage range] [DATA_NEEDED: I/O bank voltage range]
Number of PLLs [DATA_NEEDED: PLL count] —
Package Height 2.23 mm —
Total RAM Bits — 516096 bits
Number of I/O — 341
Process Technology — 130 nm flash
Terminal Form — Ball (BGA, square)
Temperature Grade — Industrial (I)
Configuration — On-chip flash, no external boot device
Packaging — Tray

Datasheets & Resources

Browse All Products Create BOM Request Quote