A3PE3000L-1FG484 vs A3PE3000L-1FG484I Vergleich

Detaillierter Direktvergleich von A3PE3000L-1FG484 von Microchip Technology und A3PE3000L-1FG484I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
A3PE3000L-1FG484 A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip

A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip

A3PE3000L-1FG484 ✓ Aktiv
Microchip Technology
A3PE3000L-1FG484I A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip

A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip

A3PE3000L-1FG484I ✓ Aktiv

Spezifikationsvergleich

Parameter A3PE3000L-1FG484 A3PE3000L-1FG484I
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $280,54 $89,90
Family ProASIC3L (Flash FPGA) ProASIC3L (Low Power Flash FPGA)
System Gates 3000000 3,000,000 gates
Logic Cells / CLBs 75264 —
Logic Elements (LEs) [DATA_NEEDED: LE count] 35 KLEs
User I/O 341 —
Embedded Memory 516096 bits —
Core Voltage 1.2 V to 1.5 V 1.2 V (family supports 1.2 V to 1.5 V)
Speed Grade -1 -1
Gehäuse 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch 484-ball FBGA (FG484)
Montageart Surface Mount Surface Mount
Configuration Technology Flash (non-volatile, single-chip) —
Special Features Flash*Freeze technology, live reprogrammability Flash*Freeze technology, non-volatile single-chip
RoHS-Status Non-Compliant (standard grade; see -FGG484 / M / I variants for compliant options) [DATA_NEEDED: RoHS compliance status]
Betriebstemperatur [DATA_NEEDED: operating temperature range] [DATA_NEEDED: exact min/max operating temperature range]
Supply Voltage - I/O [DATA_NEEDED: I/O voltage range] [DATA_NEEDED: I/O bank voltage range]
Number of PLLs [DATA_NEEDED: PLL count] —
Package Height 2.23 mm —
Total RAM Bits — 516096 bits
Number of I/O — 341
Process Technology — 130 nm flash
Terminal Form — Ball (BGA, square)
Temperature Grade — Industrial (I)
Configuration — On-chip flash, no external boot device
Packaging — Tray

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