A3PE3000L-1FG484 vs A3PE3000L-1FG484I Comparaison
Comparaison détaillée côte à côte de A3PE3000L-1FG484 par Microchip Technology et A3PE3000L-1FG484I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FG484 ✓ ActifMicrochip Technology
A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-1FG484 | A3PE3000L-1FG484I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $280,54 | $89,90 |
| Family | ProASIC3L (Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3,000,000 gates |
| Logic Cells / CLBs | 75264 | — |
| Logic Elements (LEs) | [DATA_NEEDED: LE count] | 35 KLEs |
| User I/O | 341 | — |
| Embedded Memory | 516096 bits | — |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (family supports 1.2 V to 1.5 V) |
| Speed Grade | -1 | -1 |
| Boîtier | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FG484) |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| Special Features | Flash*Freeze technology, live reprogrammability | Flash*Freeze technology, non-volatile single-chip |
| Statut RoHS | Non-Compliant (standard grade; see -FGG484 / M / I variants for compliant options) | [DATA_NEEDED: RoHS compliance status] |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: exact min/max operating temperature range] |
| Supply Voltage - I/O | [DATA_NEEDED: I/O voltage range] | [DATA_NEEDED: I/O bank voltage range] |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Package Height | 2.23 mm | — |
| Total RAM Bits | — | 516096 bits |
| Number of I/O | — | 341 |
| Process Technology | — | 130 nm flash |
| Terminal Form | — | Ball (BGA, square) |
| Temperature Grade | — | Industrial (I) |
| Configuration | — | On-chip flash, no external boot device |
| Packaging | — | Tray |