A3PE3000L-1FG484I vs A3PE3000L-FG484 Comparison
Detailed side-by-side comparison of A3PE3000L-1FG484I by Microchip Technology and A3PE3000L-FG484 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I ✓ ActiveMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ ActiveSpecification Comparison
| Parameter | A3PE3000L-1FG484I | A3PE3000L-FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $89.90 | $112.00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3,000,000 gates | 3000000 |
| Logic Elements (LEs) | 35 KLEs | — |
| Total RAM Bits | 516096 bits | — |
| Number of I/O | 341 | — |
| Core Voltage | 1.2 V (family supports 1.2 V to 1.5 V) | — |
| Process Technology | 130 nm flash | — |
| Special Features | Flash*Freeze technology, non-volatile single-chip | — |
| Speed Grade | -1 | — |
| Package | 484-ball FBGA (FG484) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Terminal Form | Ball (BGA, square) | — |
| Temperature Grade | Industrial (I) | — |
| Operating Temperature | [DATA_NEEDED: exact min/max operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Supply Voltage - I/O | [DATA_NEEDED: I/O bank voltage range] | — |
| Configuration | On-chip flash, no external boot device | Flash-based, Instant On, single-chip |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance] |
| Packaging | Tray | — |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |