A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
MPN: A3PE3000L-FG484 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $165 | $165.00 |
| 10 | $152 | $1,520.00 |
| 100 | $138 | $13,800.00 |
| 500 | $125 | $62,500.00 |
| 1,000 | $112 | $112,000.00 |
Drop-in alternatives for A3PE3000L-FG484 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3PE3000L-1FGG484I
β Drop-Inβ In Stock
$104.5 / Unit
View Datasheet βA3PE3000L-FG484M
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000L-1FG484I
β Drop-Inβ In Stock
$89.9 / Unit
View Datasheet βA3PE3000L-1FG484M
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000-FG484
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000L-FG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 |
| Logic Cells / CLBs | 75264 |
| User I/Os | 341 |
| Maximum System Frequency | 250 MHz |
| Core Voltage Range | 1.2 V to 1.5 V |
| Technology | 130 nm CMOS flash, nonvolatile |
| Configuration | Flash-based, Instant On, single-chip |
| Low Power Feature | Flash*Freeze technology |
| Package Type | 484-ball FBGA (PBGA484) |
| Package Dimensions | 23 x 23 mm, 1 mm ball pitch |
| Package Height | 2.23 mm |
| Mounting Type | Surface Mount |
| Process | CMOS |
A3PE3000L-FG484 2.23 mm Pin Configuration Guide
Complete pinout information for A3PE3000L-FG484 (2.23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-FG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-FG484 is suitable for 6 applications: Portable and Battery-Powered Instrumentation, Industrial Control and Automation, Secure Military and Communications Equipment, Medical Diagnostic Devices, Aerospace and UAV Systems, Test and Measurement Equipment.
Portable and Battery-Powered Instrumentation
The A3PE3000L-FG484 fits portable instrumentation because its 1.2 V core option minimizes dynamic current and its Flash*Freeze technology drops static power to near zero in standby while preserving state for fast wake-up. In a handheld data logger, the FPGA handles sensor interfacing, glue logic, and display control between measurements; entering Flash*Freeze between sampling events stretches battery life substantially compared to an SRAM FPGA, which cannot gate its configuration fabric. The single-chip flash configuration also removes the boot PROM and its quiescent current from the power budget. Designers should place the device in Flash*Freeze during idle intervals and budget the 1.2 V versus 1.5 V core setting against the required 250 MHz-class timing closure.
Recommended
Industrial Control and Automation
Industrial controllers benefit from the A3PE3000L-FG484's nonvolatile, secure, single-chip architecture: the design loads instantly at power-up, supporting fast machine startup, and the flash bitstream never traverses an external bus, resisting configuration-cloning attacks common in factory equipment. With 75,264 logic cells and 341 user I/Os, one device integrates motor-interface glue logic, encoder processing, safety interlock logic, and fieldbus bridges that would otherwise require several CPLDs. The industrial-temperature sibling A3PE3000L-1FGG484I is preferred on the same footprint for harsh plant-floor environments. Wide 1.2 V to 1.5 V core operation allows power-versus-performance tuning per motion-control timing requirements, and the mature 130 nm flash process offers proven long-term availability for multi-year industrial product lifecycles.
Recommended
Secure Military and Communications Equipment
Defense and secure-communications designs favor flash FPGAs because the bitstream resides only in on-chip nonvolatile flash, eliminating the configuration-readback attack surface of SRAM FPGAs that must load from an external device at every power-up. The A3PE3000L-FG484 provides 3 million gates and 341 I/Os for protocol bridging, encryption pre-processing, and bus interface functions in man-portable radios and secure telemetry units where the L-family low standby power extends mission battery endurance. Its Instant On behavior supports receivers that must be operational within milliseconds of power application. For programs requiring extended temperature ratings, the same 484-ball FBGA footprint is populated with the A3PE3000L-1FGG484I grade, allowing one qualified PCB across program variants.
Recommended
Medical Diagnostic Devices
Medical diagnostic instruments - portable ultrasound front ends, blood analyzers, and patient-monitoring hubs - require quiet, predictable logic with long service life. The A3PE3000L-FG484's flash fabric avoids SRAM configuration cycles that add noise and boot latency, while Flash*Freeze lets the device sleep between acquisition windows in battery-operated monitors. Its 75,264 cells integrate ADC framing, filtering pre-processing, and USB or display bridging in one chip, shrinking the board area of handheld diagnostics. The deterministic, radiation-immune configuration storage suits devices that must retain calibration logic across power cycles. Designers typically pair the FPGA with precision analog front ends and hold the core at 1.2 V to reduce internal switching noise coupling into sensitive measurement channels.
Recommended
Aerospace and UAV Systems
In UAV avionics and payload controllers, the A3PE3000L-FG484 implements sensor fusion glue logic, camera interface bridging, and flight-computer I/O expansion. The flash-based Instant On configuration matters during rapid power-on sequences at launch, and the low-power L variant reduces average draw in endurance-limited electric airframes. The 484-ball FBGA's 23 x 23 mm, 1 mm-pitch footprint packs 341 I/Os into a small, thermally benign area suitable for conduction-cooled boards. Nonvolatile configuration also improves single-event functional safety posture compared with SRAM fabrics that lose configuration on upset. For space-constrained autopilot boards needing fewer gates, the same ProASIC3L architecture scales down within the family, preserving toolchain and IP reuse via Microchip Libero SoC.
Recommended
Test and Measurement Equipment
Bench instruments and modular test systems use the A3PE3000L-FG484 as timing, trigger, and interface logic where deterministic Instant On operation shortens instrument warm-up - a visible differentiator in rack environments. The 250 MHz-class fabric timing handles counter/timer channels, pattern generators, and bus interfaces (GPIB-to-USB or LXI bridges), while 341 user I/Os connect front-panel controls, relays, and multi-channel acquisition front ends. Flash configuration immunity to configuration corruption improves field reliability for instruments expected to power-cycle thousands of times per year. The Flash*Freeze mode lets battery-cordless handheld testers idle between measurements. One 484-ball FBGA footprint supports both the standard FG484 and the industrial 1FGG484I grade, simplifying qualification across product temperature variants.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-FG484 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1FGG484I | A3PE3000L-FG484M | A3PE3000L-1FG484I | A3PE3000-FG484 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) | 484-ball FBGA - same footprint | 484-ball FBGA - same footprint | 484-ball FBGA - same footprint | 484-ball FBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 341 | 341 | 341 | 341 | [DATA_NEEDED] |
| Max Frequency | 250 MHz | 250 MHz class (speed grade dependent) | 250 MHz | Lower (speed grade -1) | 231 MHz |
| Flash*Freeze Low Power Mode | Yes | Yes | Yes | Yes | No (ProASIC3E) |
| Temperature Grade | Commercial (base) | Industrial (-I) | Base (M packing) | Industrial (-I) | Commercial (base) |
| Lead-Free Ball Finish | FG (standard) | FGG (lead-free) | FG (standard) | FG (standard) | FG (standard) |
Key Differentiators
- Flash*Freeze low-power standby mode (vs A3PE3000-FG484)
- Industrial temperature option on identical footprint (vs A3PE3000L-1FGG484I)
- Nonvolatile single-chip configuration vs SRAM competitors (vs Lattice ECP3 / Xilinx Artix-class (functional equivalents))
- Lower cost speed-grade option for cost-sensitive builds (vs A3PE3000L-1FG484I)
Design Notes
Exploit the 1.2 V to 1.5 V core range deliberately: run the core at 1.2 V when your timing closure passes with margin, since core current scales down significantly at the lower setting, and reserve 1.5 V for paths that need the full 250 MHz-class performance. Use Flash*Freeze during idle periods in duty-cycled systems; verify that all I/O states your system depends on are retained per the Flash*Freeze entry conditions in the Microchip ProASIC3L datasheet (DS50003268) before asserting the mode.
The 484-ball FBGA has a 1.0 mm ball pitch on a 23 x 23 mm body - plan for a via-in-pad or dog-bone escape strategy on outer rows and at least 4 signal layers to escape the center balls. Provide dedicated solid planes for core and I/O supplies with decoupling capacitors (a mix of bulk and 0.1 uF ceramics) distributed around the package perimeter. Follow Microchip's ProASIC3L PCB layout guidelines for ball-map breakout patterns to avoid routing dead zones under the array.
Do not treat cross-brand FPGA equivalents (Lattice ECP3, Xilinx Artix-class, Intel Cyclone IV) as substitutes on an existing PCB: they differ in package, pinout, and configuration architecture (SRAM vs flash), requiring full redesign. Within ProASIC3L, confirm speed grade and temperature suffix before BOM substitution - the -1 speed grade parts relax timing versus the base grade. Validate I/O banking assignments early in Libero SoC to avoid mixed-voltage conflicts that force a board respin.
Compliance Information
Compliance status not stated in the provided verified web data. Lead-free variants exist in the family (FGG suffix denotes lead-free ball finish per distributor comparison data); confirm RoHS/REACH status per specific ordering code on the Microchip product page.
