A3PE3000L-1FG484I vs A3PE3000L-FG484 Comparaison
Comparaison détaillée côte à côte de A3PE3000L-1FG484I par Microchip Technology et A3PE3000L-FG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I ✓ ActifMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-1FG484I | A3PE3000L-FG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $89,90 | $112,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3,000,000 gates | 3000000 |
| Logic Elements (LEs) | 35 KLEs | — |
| Total RAM Bits | 516096 bits | — |
| Number of I/O | 341 | — |
| Core Voltage | 1.2 V (family supports 1.2 V to 1.5 V) | — |
| Process Technology | 130 nm flash | — |
| Special Features | Flash*Freeze technology, non-volatile single-chip | — |
| Speed Grade | -1 | — |
| Boîtier | 484-ball FBGA (FG484) | — |
| Type de montage | Surface Mount | Surface Mount |
| Terminal Form | Ball (BGA, square) | — |
| Temperature Grade | Industrial (I) | — |
| Température de fonctionnement | [DATA_NEEDED: exact min/max operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Supply Voltage - I/O | [DATA_NEEDED: I/O bank voltage range] | — |
| Configuration | On-chip flash, no external boot device | Flash-based, Instant On, single-chip |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance] |
| Packaging | Tray | — |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Technology | — | 130 nm CMOS flash, nonvolatile |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |