A3PE3000L-1FGG896I vs A3PE3000L-1FGG896 Comparison
Detailed side-by-side comparison of A3PE3000L-1FGG896I by Microchip Technology and A3PE3000L-1FGG896 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG896I ✓ ActiveMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ ActiveSpecification Comparison
| Parameter | A3PE3000L-1FGG896I | A3PE3000L-1FGG896 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $255.00 |
| Family | ProASIC3L (Flash FPGAs with Flash*Freeze) | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| User I/O | 620 | 620 |
| Embedded SRAM | 504 kbits true dual-port | — |
| Package | 896-ball FBGA, 1 mm pitch | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Speed Grade | -1 | -1 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| PLLs | 6 | — |
| Maximum System Performance | Approx. 272 MHz | — |
| Configuration Technology | Nonvolatile flash, single-chip, Instant On | — |
| Low Power Feature | Flash*Freeze Technology | — |
| Operating Temperature | -40C to +85C (industrial, I suffix) | — |
| Logic Family | CMOS | — |
| Mounting Type | Surface Mount | Surface Mount |
| Power-Up Support | Live at Power-Up Level 0 | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| Logic Cells | — | 75264 |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| I/O Voltage | — | As low as 1.2 V |
| Configuration Memory | — | Nonvolatile flash (single-chip) |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |