A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
MPN: A3PE3000L-1FGG896 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $350 | $350.00 |
| 10 | $325 | $3,250.00 |
| 100 | $298 | $29,800.00 |
| 500 | $275 | $137,500.00 |
| 1,000 | $255 | $255,000.00 |
Drop-in alternatives for A3PE3000L-1FGG896 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-FGG896
✅ Drop-In✓ In Stock
$55 / Unit
View Datasheet →A3PE3000L-1FGG896I
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-FG896
✅ Drop-In✓ In Stock
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View Datasheet →A3PE3000L-FG896I
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-1FG896YM
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000L-1FGG896M
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000L-1FGG896 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L |
| System Gates | 3000000 |
| Logic Cells | 75264 |
| User I/O | 620 |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) |
| I/O Voltage | As low as 1.2 V |
| Speed Grade | -1 |
| Process Technology | 130 nm flash |
| Configuration Memory | Nonvolatile flash (single-chip) |
| Special Features | Flash*Freeze technology |
| Package | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Terminal Pitch | 1.00 mm |
| Technology Base | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | Approx. 40% |
| Static Power Reduction vs ProASIC3 | Approx. 50% |
A3PE3000L-1FGG896 896-ball fbga (fgg896), 1.00 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000L-1FGG896 (896-ball fbga (fgg896), 1.00 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1FGG896.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1FGG896 is suitable for 6 applications: Portable and Battery-Powered Instrumentation, Industrial Control and Automation, Medical Monitoring and Diagnostic Equipment, Communications Line Cards and Network Processing, Aerospace and Defense Subsystems, Test and Measurement Equipment.
Portable and Battery-Powered Instrumentation
The A3PE3000L-1FGG896 fits portable instrumentation because its ProASIC3L fabric cuts static power roughly 50% versus standard ProASIC3 and its Flash*Freeze mode drops the 3M-gate device into ultra-low-power standby while retaining SRAM state and live I/Os. The 1.2 V core and I/O rails as low as 1.2 V minimize dynamic power, which scales with the square of voltage. In a handheld data logger or field tester, the FPGA processes sensor interfaces continuously, then enters Flash*Freeze between measurement cycles, extending battery life substantially. Nonvolatile flash configuration also means no boot energy is spent loading a bitstream, an advantage over SRAM FPGAs in duty-cycled systems.
Recommended
Industrial Control and Automation
In industrial controllers, motor-communication gateways, and factory automation nodes, the A3PE3000L-1FGG896 provides 75,264 logic cells and 620 user I/Os to glue together PLC backplanes, fieldbus transceivers, and safety interlocks on a single chip. The nonvolatile flash fabric powers up instantly and functional at power-up - critical for machinery that must be operational immediately after energization, without a configuration controller. The -1 speed grade balances timing performance with power, and industrial-temperature sibling A3PE3000L-1FGG896I covers harsh environments. Multiple I/O banks operating down to 1.2 V let one device bridge legacy 3.3 V signals and modern low-voltage peripherals.
Recommended
Medical Monitoring and Diagnostic Equipment
Medical patient monitors, ultrasound front ends, and diagnostic analyzers benefit from the A3PE3000L-1FGG896's combination of density (3M gates, 75,264 cells) and quiet, low-power operation. The flash-based fabric generates no configuration bus switching noise at power-up and supports instant-on operation required for devices that must respond immediately in clinical settings. The 620 I/Os interface high-channel-count sensor arrays, while the 1.2 V I/O banks connect directly to modern low-voltage ADCs. Flash*Freeze lets bedside devices remain responsive to wake-up events while dramatically reducing standby draw, extending operation on battery backup during patient transport.
Recommended
Communications Line Cards and Network Processing
For telecom and networking line cards, the A3PE3000L-1FGG896 implements protocol bridging, framing, and backplane interface logic where 620 I/Os enable wide parallel data paths to PHYs and framers. The ProASIC3L fabric's reduced static power matters in racks where hundreds of cards are energized continuously; Flash*Freeze provides additional savings on standby or lightly utilized ports. Nonvolatile configuration means a card is live within microseconds of slot insertion, simplifying hot-swap sequencing versus SRAM FPGAs that must be configured over a bus. Multiple voltage banks (down to 1.2 V) interface directly with modern low-voltage transceiver components.
Recommended
Aerospace and Defense Subsystems
Microsemi (now Microchip) flash FPGAs have a long heritage in aerospace payloads and defense electronics, and the A3PE3000L-1FG896YM military-grade ordering variant of this same die serves those programs. The single-chip, nonvolatile flash configuration eliminates the configuration-store attack surface and improves boot reliability in radiation-prone or secure environments. The 3M-gate density handles sensor preprocessing, telemetry formatting, and bus interface (MIL-STD-class functions implemented in fabric), while Flash*Freeze supports duty-cycled satellite payloads where average power is strictly budgeted. Designers should consult Microchip's aerospace documentation for the appropriate qualified variant and flow.
Recommended
Test and Measurement Equipment
Bench instruments, automated test equipment (ATE), and logic analyzers exploit the A3PE3000L-1FGG896's 75,264 logic cells for real-time trigger engines, pattern generators, and timing-correlation logic. The 620 user I/Os connect to dense channel arrays, and the 1.00 mm pitch 896-ball FBGA escapes signals across multiple board layers with 8+ layer stackups typical of T&M hardware. Instant-on flash configuration lets the instrument be measurement-ready the moment power is applied - an ergonomic advantage for bench users. The -1 speed grade provides ample timing margin for channel rates typical of mainstream instrumentation while keeping power and cost below faster speed grades.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1FGG896 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-FGG896 | A3PE3000L-1FGG896I | A3PE3000L-FG896 | A3PE3000L-1FG896YM | A3PE3000L-1FGG896M |
|---|---|---|---|---|---|---|
| Package | 896-ball FBGA (FGG896), 1.00 mm pitch | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FGG896) - same | 896-ball FBGA (FG896) - same footprint, standard finish | 896-ball FBGA (FG896) - same footprint | 896-ball FBGA (FGG896) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75264 | 75264 | 75264 | 75264 | 75264 | 75264 |
| User I/O | 620 | 620 | 620 | 620 | 620 | 620 |
| Speed Grade | -1 | different (no -1 suffix) | -1 | different (no -1 suffix) | -1 | -1 |
| Core Voltage | 1.2 V (1.2 V to 1.5 V) | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Temperature Range | [DATA_NEEDED: Commercial temperature range] | [DATA_NEEDED] | Industrial (extended, -I suffix) | [DATA_NEEDED] | Military-grade (Y suffix) | [DATA_NEEDED] |
| Flash*Freeze Technology | Yes | Yes | Yes | Yes | Yes | Yes |
| Configuration | Nonvolatile flash (single-chip) | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
Key Differentiators
- Low-power ProASIC3L fabric with Flash*Freeze (vs A3PE3000-FGG324I)
- Nonvolatile single-chip flash configuration (vs SRAM FPGAs (functional class))
- Maximum I/O count in the family package (vs A3PE3000L-FGG324I)
- Trade-off: speed grade (vs A3PE3000L-FGG896)
Design Notes
Plan the power tree around the ProASIC3L's dual-rail scheme: a 1.2 V to 1.5 V core rail (1.2 V recommended for lowest dynamic power) and per-bank VCCI rails that may go as low as 1.2 V. Power scales roughly with the square of voltage, so running core and I/O at 1.2 V instead of 1.5 V yields significant savings in a 3M-gate design. Use Flash*Freeze aggressively for idle states - it retains SRAM and keeps I/Os live - and sequence the Flash*Freeze pin through controlled logic so the device never enters the mode while timing-critical transactions are in flight.
The 896-ball FBGA at 1.00 mm pitch requires a fine-pitch capable assembly process and an 8+ layer PCB with microvia or via-in-pad fanout. Follow the manufacturer datasheet's recommended land pattern and ball-map escape routing (fanout typically on 0.5 mm via grids). Assign I/O banks before finalizing the schematic: each bank has a VCCI rail, and mixing voltage standards within one bank is not permitted. Reserve ground balls adjacent to high-toggle I/O clusters and place 0.1 uF ceramic decoupling capacitors on the underside directly under the BGA, plus bulk capacitance at each rail.
Do not confuse ordering-code variants: FGG denotes lead-free ball finish and FG the standard finish; -I is industrial temperature, Y the military variant, and the -1 digit is the speed grade. Substituting across these requires verifying temperature and finish requirements, and any speed-grade change may break worst-case timing closure - re-run static timing analysis in Libero after any substitution. Also verify via the current Microchip datasheet revision that your chosen part status is active, since the family originated at Actel/Microsemi and some ordering codes have been consolidated.
Compliance Information
The FGG suffix denotes lead-free/RoHS ball metallurgy per Microchip ordering-code convention; Mouser lists A3PE3000L-FGG896 as LEAD FREE. REACH, halogen-free, and conflict-minerals status not stated in provided data.
