A3PE3000L-1FGG896I vs A3PE3000L-1FGG896 Comparaison
Comparaison détaillée côte à côte de A3PE3000L-1FGG896I par Microchip Technology et A3PE3000L-1FGG896 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG896I ✓ ActifMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-1FGG896I | A3PE3000L-1FGG896 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $255,00 |
| Family | ProASIC3L (Flash FPGAs with Flash*Freeze) | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| User I/O | 620 | 620 |
| Embedded SRAM | 504 kbits true dual-port | — |
| Boîtier | 896-ball FBGA, 1 mm pitch | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Speed Grade | -1 | -1 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| PLLs | 6 | — |
| Maximum System Performance | Approx. 272 MHz | — |
| Configuration Technology | Nonvolatile flash, single-chip, Instant On | — |
| Low Power Feature | Flash*Freeze Technology | — |
| Température de fonctionnement | -40C to +85C (industrial, I suffix) | — |
| Logic Family | CMOS | — |
| Type de montage | Surface Mount | Surface Mount |
| Power-Up Support | Live at Power-Up Level 0 | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Cells | — | 75264 |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| I/O Voltage | — | As low as 1.2 V |
| Configuration Memory | — | Nonvolatile flash (single-chip) |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |