A3PE3000L-FG324I vs A3PE3000-FGG324I Comparison
Detailed side-by-side comparison of A3PE3000L-FG324I by Microchip Technology and A3PE3000-FGG324I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip
A3PE3000L-FG324I ✓ ActiveMicrochip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ ActiveSpecification Comparison
| Parameter | A3PE3000L-FG324I | A3PE3000-FGG324I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $198.00 |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3E (ProASIC3E Flash Family) |
| System Gates | 3,000,000 | 3000000 gates |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | — |
| Embedded SRAM | 516096 bits (up to 144 kbits true dual-port blocks per family) | — |
| Core Voltage | 1.2 V (1.2 V to 1.5 V supported) | — |
| Process Technology | 130 nm CMOS, 7-layer metal (6 copper), flash-based | — |
| Configuration | Nonvolatile flash, Instant On (Level 0 support) | — |
| Low Power Feature | Flash*Freeze technology | — |
| Max Frequency | [DATA_NEEDED: maximum system frequency] | — |
| JTAG Boundary Scan | IEEE 1149.1 | — |
| Input Option | Schmitt Trigger on single-ended inputs | — |
| Package | 324-ball FBGA (FG324), 19x19 mm | 324-BGA (FBGA/PBGA324), 19 x 19 mm |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial, I suffix) | -40 C to +125 C (Industrial, I grade) |
| RoHS Status | Non-Compliant (FG package contains lead) | [DATA_NEEDED: RoHS status] |
| Lead Free Status | Contains Lead | — |
| Logic Elements (CLBs) | — | 75264 |
| Total User I/O | — | 221 |
| Embedded Memory | — | 516096 bits |
| Maximum Frequency | — | 350 MHz |
| Core Supply Voltage | — | 1.5 V |
| Technology | — | 130 nm CMOS, nonvolatile flash |
| Ball Pitch | — | 1 mm |
| Package Height | — | 1.63 mm |
| Configuration Memory | — | Nonvolatile flash, reprogrammable, Instant-On |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |