A3PE3000L-FG324I vs A3PE3000-FGG324I Comparaison
Comparaison détaillée côte à côte de A3PE3000L-FG324I par Microchip Technology et A3PE3000-FGG324I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip
A3PE3000L-FG324I ✓ ActifMicrochip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-FG324I | A3PE3000-FGG324I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $198,00 |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3E (ProASIC3E Flash Family) |
| System Gates | 3,000,000 | 3000000 gates |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | — |
| Embedded SRAM | 516096 bits (up to 144 kbits true dual-port blocks per family) | — |
| Core Voltage | 1.2 V (1.2 V to 1.5 V supported) | — |
| Process Technology | 130 nm CMOS, 7-layer metal (6 copper), flash-based | — |
| Configuration | Nonvolatile flash, Instant On (Level 0 support) | — |
| Low Power Feature | Flash*Freeze technology | — |
| Max Frequency | [DATA_NEEDED: maximum system frequency] | — |
| JTAG Boundary Scan | IEEE 1149.1 | — |
| Input Option | Schmitt Trigger on single-ended inputs | — |
| Boîtier | 324-ball FBGA (FG324), 19x19 mm | 324-BGA (FBGA/PBGA324), 19 x 19 mm |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +100C (Industrial, I suffix) | -40 C to +125 C (Industrial, I grade) |
| Statut RoHS | Non-Compliant (FG package contains lead) | [DATA_NEEDED: RoHS status] |
| Lead Free Status | Contains Lead | — |
| Logic Elements (CLBs) | — | 75264 |
| Total User I/O | — | 221 |
| Embedded Memory | — | 516096 bits |
| Maximum Frequency | — | 350 MHz |
| Core Supply Voltage | — | 1.5 V |
| Technology | — | 130 nm CMOS, nonvolatile flash |
| Ball Pitch | — | 1 mm |
| Package Height | — | 1.63 mm |
| Configuration Memory | — | Nonvolatile flash, reprogrammable, Instant-On |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL Level] |