A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip
MPN: A3PE3000L-FG324I ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for A3PE3000L-FG324I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-FGG324I
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View Datasheet →A3PE3000L-FG324I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Flash-based FPGA) |
| System Gates | 3,000,000 |
| Logic Cells (CLBs) | 75264 |
| User I/O | 221 |
| Embedded SRAM | 516096 bits (up to 144 kbits true dual-port blocks per family) |
| Core Voltage | 1.2 V (1.2 V to 1.5 V supported) |
| Process Technology | 130 nm CMOS, 7-layer metal (6 copper), flash-based |
| Configuration | Nonvolatile flash, Instant On (Level 0 support) |
| Low Power Feature | Flash*Freeze technology |
| JTAG Boundary Scan | IEEE 1149.1 |
| Input Option | Schmitt Trigger on single-ended inputs |
| Package | 324-ball FBGA (FG324), 19x19 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial, I suffix) |
| RoHS Status | Non-Compliant (FG package contains lead) |
| Lead Free Status | Contains Lead |
A3PE3000L-FG324I 324-ball fbga (fg324), 19x19 mm Pin Configuration Guide
Complete pinout information for A3PE3000L-FG324I (324-ball fbga (fg324), 19x19 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-FG324I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-FG324I is suitable for 6 applications: Industrial Automation Controllers, Battery-Powered Portable Instrumentation, Aerospace and Defense Control Logic, Communications Line-Card Bridging, Medical Diagnostic Equipment, Legacy System Sustainment and Spares.
Industrial Automation Controllers
Industrial PLC and motion-control logic benefits directly from the A3PE3000L-FG324I's 3 million system gates, 221 user I/Os, and -40C to +100C industrial rating. Its nonvolatile flash fabric gives Instant On startup, so machine-control state machines are live the moment 1.2V core power is applied - no configuration loader means shorter, deterministic boot sequences on factory lines. The 516096-bit embedded SRAM (true dual-port) buffers sensor FIFOs and communication frames, while IEEE 1149.1 boundary scan simplifies in-cabinet board test. Flash*Freeze can hold logic state during idle periods, and the 130-nm flash process avoids SEU-prone configuration memory, improving uptime in electrically noisy motor-drive cabinets.
Recommended
Battery-Powered Portable Instrumentation
Portable test and measurement instruments gain from the ProASIC3L's low-power architecture: the 1.2V core option reduces dynamic power, and Flash*Freeze technology cuts static current dramatically while preserving register and block-RAM state between measurements - ideal for duty-cycled handheld devices. With 221 I/Os in a compact 19x19 mm 324-FBGA, the A3PE3000L-FG324I integrates display, keypad, sensor, and communication interfaces into one programmable device, replacing several CPLDs or glue-logic ICs. Instant On flash configuration eliminates boot delay after battery insertion, and the Schmitt-trigger input option conditions noisy pushbutton and encoder signals without external components, extending battery life and simplifying the power tree.
Recommended
Aerospace and Defense Control Logic
Defense subsystems favor flash-based FPGAs because configuration stored in flash cells is inherently more resistant to configuration upsets than SRAM-based alternatives - important for flight control, telemetry, and secure communications boards. The A3PE3000L-FG324I's 3M-gate capacity hosts protocol bridges, bus interfaces (MIL-STD-style control planes), and crypto-adjacent glue logic, while 144 kbits of true dual-port SRAM implements ping-pong buffers for data links. The industrial -40C to +100C grade suits unconditioned avionics bays, and JTAG boundary scan supports depot-level test. Note: the FG package is RoHS non-compliant, which is generally acceptable in defense exemptions but should be documented in the program's compliance plan.
Recommended
Communications Line-Card Bridging
Telecom line cards use the A3PE3000L-FG324I to bridge backplane buses to PHY devices: the 3M-gate fabric implements framing, deskew, and status aggregation while the 516096-bit dual-port SRAM crosses clock domains between line-side and system-side logic. 221 I/Os terminate multiple low-speed parallel links, with Schmitt-trigger inputs cleaning noisy cabinet-level signaling. Instant On flash configuration lets the card pass traffic immediately after hot-swap power application, and Flash*Freeze provides a low-power standby mode for cards in idle slots - a quantifiable power saving across large chassis. The industrial grade supports central-office temperature requirements.
Recommended
Medical Diagnostic Equipment
Benchtop diagnostic instruments exploit the A3PE3000L-FG324I's deterministic, single-chip operation: flash configuration means no configuration-device failure modes and no boot-time configuration corruption, supporting the reliability expectations of laboratory analyzers and patient-adjacent equipment. The 3M gates sequence high-channel-count sensor arrays, the 516096-bit SRAM buffers waveform capture, and the 221 I/Os drive motors, valves, and communication ports. Low static power via Flash*Freeze reduces heat inside enclosed instrument housings, easing fanless thermal design, while the industrial temperature range tolerates variable clinic environments. Designers should verify IEC 60601 system-level isolation external to the FPGA.
Recommended
Legacy System Sustainment and Spares
Many fielded boards were designed around Actel ProASIC3L parts in the leaded FG324 package. For maintainers sourcing spares, the A3PE3000L-FG324I remains listed by distributors as of 2026-09-02, and where RoHS exemptions do not apply, the footprint-identical A3PE3000L-FGG324I drops onto the same PCB land pattern with no rework. Because the flash fabric is reprogrammable in-system via JTAG with Libero SoC, depots can update design revisions on installed hardware without desoldering - a significant sustainment advantage. Keep identical Libero project archives and FlashPro programming files to guarantee bitstream reproducibility across spare batches.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-FG324I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-FGG324I | A3PE3000L-1FGG324I | A3PE3000-FG324I | A3PE3000-FGG324I |
|---|---|---|---|---|---|
| Package | 324-ball FBGA (FG324) | 324-ball FBGA - same footprint, lead-free balls | 324-ball FBGA - same footprint | 324-ball FBGA - same footprint | 324-ball FBGA - same footprint |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 221 | 221 | 221 | 221 | 221 |
| Flash*Freeze Low-Power Mode | Yes (ProASIC3L) | Yes | Yes | No (ProASIC3E) | No (ProASIC3E) |
| Speed Grade | Standard (-0) | Standard (-0) | -1 (faster) | Standard (-0) | Standard (-0) |
| RoHS Compliance | Non-Compliant (leaded balls) | Compliant | Compliant | Non-Compliant (leaded balls) | Compliant |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
Key Differentiators
- Flash*Freeze low-power technology (vs A3PE3000-FG324I)
- RoHS-compliant drop-in option exists (vs A3PE3000L-FGG324I)
- Instant On single-chip configuration (vs A3PE3000-FG324I (and SRAM FPGAs generally))
Design Notes
Power the 1.2V core from a dedicated regulator; the ProASIC3L accepts a 1.2V to 1.5V core range, so a single 1.2V rail minimizes static power, while 1.5V core operation buys additional timing margin at the standard speed grade. I/O banks require their own VCCI supplies, so plan bank voltage grouping before pin assignment in Libero. Because flash configuration is Instant On, ensure supply ramp sequencing meets the datasheet power-up requirements so state machines initialize cleanly - no configuration-device handshaking is needed.
The 324-ball FBGA dissipates heat primarily through the ball array into the PCB. For the 3M-gate A3PE3000L at high toggle rates, provide solid via fanout under the package to internal ground planes and at least 2-oz copper on outer layers if ambient exceeds 70C; industrial -40C to +100C operation leaves limited junction margin. Estimated: logic power scales with toggle rate in Libero's power estimator - run it with your actual design activity factors rather than worst-case defaults before finalizing the thermal budget.
The most common sourcing error is mixing FG and FGG suffixes: the FG package contains leaded balls and is RoHS non-compliant, while FGG is the lead-free equivalent on the identical footprint - always match your compliance documentation when ordering. Second, do not substitute A3PE3000 (ProASIC3E) parts into Flash*Freeze-based low-power designs without re-verifying standby power. Finally, when moving between -0 and -1 speed grades, re-run timing closure in Libero; constraints that close at -1 may fail at standard grade.
Compliance Information
Per datasheet listings, A3PE3000L-FG324I is RoHS non-compliant and contains lead (FG package standard balls). The FGG (lead-free ball) variants are RoHS compliant. Use A3PE3000L-FGG324I for RoHS-regulated designs.
