A3PE3000L-PQG208I vs A3PE3000L-PQ208I Comparison
Detailed side-by-side comparison of A3PE3000L-PQG208I by Microchip Technology and A3PE3000L-PQ208I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
A3PE3000L-PQG208I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-PQG208I ✓ ActiveMicrochip Technology
A3PE3000L-PQ208I - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-PQ208I ✓ ActiveSpecification Comparison
| Parameter | A3PE3000L-PQG208I | A3PE3000L-PQ208I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $48.90 | $89.75 |
| Family | ProASIC3L | ProASIC3L |
| System Gates | 3000000 | 3,000,000 |
| Total RAM Bits | 516096 | 516,096 |
| Number of I/O | 147 | — |
| Supply Voltage Range | 1.14 V to 1.575 V | — |
| Core Voltage | 1.2 V (low-power option), 1.2 V to 1.5 V range | — |
| Operating Temperature | -40C to +100C (TJ) | — |
| Package | 208-BFQFP (PQFP 28x28 mm) | 208-BFQFP (PQ208) |
| Mounting Type | Surface Mount | Surface Mount |
| Technology | 130 nm flash process | — |
| Maximum Operating Frequency | 781.25 MHz | — |
| Configuration Memory | On-chip flash, single-chip (no external boot device) | Nonvolatile Flash (Live at Power-Up, Level 0) |
| Special Features | FlashFreeze technology, Power Driven Layout support | — |
| Moisture Sensitivity | MSL rated (Yes per distributor data) | — |
| Packaging | Tray, factory pack quantity 24 | — |
| RoHS Status | Lead free (per Microchip/Mouser listing of family) | Compliant |
| Height | 3.4 mm | — |
| Length x Width | 28 mm x 28 mm | — |
| Logic Cells (CLBs) | — | 75,264 |
| Embedded Memory | — | 504 kbits True Dual-Port SRAM |
| User I/Os | — | 147 |
| Supply Voltage | — | 1.14 V to 1.575 V |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Logic Family | — | CMOS |
| Low Power Feature | — | Flash*Freeze Technology |
| Max I/Os (Device Family) | — | 616 |