A3PE600-2FGG484I vs A3PE600-FGG484 Comparison

Detailed side-by-side comparison of A3PE600-2FGG484I by Microchip Technology and A3PE600-FGG484 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3PE600-2FGG484I A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip

A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip

A3PE600-2FGG484I ✓ Active
Microchip Technology
A3PE600-FGG484 A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-FGG484 ✓ Active

Specification Comparison

Parameter A3PE600-2FGG484I A3PE600-FGG484
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $53.70
Family ProASIC3E Flash FPGA ProASIC3E
System Gates 600000 600000
Logic Elements (CLBs) 13824 —
Number of Registers [DATA_NEEDED: number of registers] —
User I/Os (max, FG484) 270 —
Speed Grade -2 —
Core Supply Voltage 1.5 V —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Technology 130 nm Flash CMOS —
Max System Frequency 231 MHz —
Embedded Memory Embedded flash family; 110592 (bits, per distributor listing) —
Configuration Memory On-chip flash (single-chip, non-volatile) On-chip flash (non-volatile, live at power-up)
Soft CPU Support Optional soft ARM support —
Package FBGA-484 (PBGA484, 23 x 23 mm, 1.0 mm pitch, 2.23 mm height) FBGA-484 (PBGA484)
Mounting Type Surface Mount —
Operating Temperature -40C to +100C (Industrial) —
Terminal Form Ball —
Number of Terminals 484 —
RoHS Status [DATA_NEEDED: RoHS status] Green / [DATA_NEEDED: RoHS compliance detail]
Packaging Tray —
Configurable Logic Blocks (CLBs) — 13824
Logic Cells — 13824
Embedded RAM — 110592 bits
User I/O — 270
Maximum System Frequency — 350 MHz
Supply Voltage (Core) — 1.425 V to 1.575 V
Process Technology — 130 nm CMOS flash
Package Dimensions — 23 x 23 mm, 2.23 mm height, 1 mm pitch
Terminal Type — Ball (BGA)
Mounting Style — Surface Mount
Temperature Grading — Commercial
Number of Pins / Balls — 484

Datasheets & Resources

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