A3PE600-2FGG484I vs A3PE600-FGG484 Comparação

Comparação detalhada lado a lado de A3PE600-2FGG484I por Microchip Technology e A3PE600-FGG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
A3PE600-2FGG484I A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip

A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip

A3PE600-2FGG484I ✓ Ativo
Microchip Technology
A3PE600-FGG484 A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip

A3PE600-FGG484 ✓ Ativo

Comparação de especificações

Parâmetro A3PE600-2FGG484I A3PE600-FGG484
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $53,70
Family ProASIC3E Flash FPGA ProASIC3E
System Gates 600000 600000
Logic Elements (CLBs) 13824 —
Number of Registers [DATA_NEEDED: number of registers] —
User I/Os (max, FG484) 270 —
Speed Grade -2 —
Core Supply Voltage 1.5 V —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Technology 130 nm Flash CMOS —
Max System Frequency 231 MHz —
Embedded Memory Embedded flash family; 110592 (bits, per distributor listing) —
Configuration Memory On-chip flash (single-chip, non-volatile) On-chip flash (non-volatile, live at power-up)
Soft CPU Support Optional soft ARM support —
Encapsulamento FBGA-484 (PBGA484, 23 x 23 mm, 1.0 mm pitch, 2.23 mm height) FBGA-484 (PBGA484)
Tipo de montagem Surface Mount —
Temperatura de operação -40C to +100C (Industrial) —
Terminal Form Ball —
Number of Terminals 484 —
Status RoHS [DATA_NEEDED: RoHS status] Green / [DATA_NEEDED: RoHS compliance detail]
Packaging Tray —
Configurable Logic Blocks (CLBs) — 13824
Logic Cells — 13824
Embedded RAM — 110592 bits
User I/O — 270
Maximum System Frequency — 350 MHz
Supply Voltage (Core) — 1.425 V to 1.575 V
Process Technology — 130 nm CMOS flash
Package Dimensions — 23 x 23 mm, 2.23 mm height, 1 mm pitch
Terminal Type — Ball (BGA)
Estilo de montagem — Surface Mount
Temperature Grading — Commercial
Number of Pins / Balls — 484

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