AFS600-FG256I vs M7AFS600-FGG256I Comparison
Detailed side-by-side comparison of AFS600-FG256I by Microchip Technology and M7AFS600-FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology
AFS600-FG256I ✓ ActiveMicrochip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ ActiveSpecification Comparison
| Parameter | AFS600-FG256I | M7AFS600-FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600K |
| Configurable Logic Blocks | 13,824 CLBs | — |
| User I/O | 119 I/O | 119 |
| Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash memory | — |
| Power-Up Feature | Live at Power-Up (LAPU) | — |
| Logic Family | CMOS | — |
| Package Type | 256-LBGA | — |
| Package Pitch | 1.0 mm | — |
| Number of Package Balls | 256 balls | — |
| Package Shape | Square | — |
| Mounting Type | Surface mount | Surface Mount |
| Operating Temperature | 0 C to 70 C | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Family | — | Fusion Mixed-Signal FPGA |
| Package | — | 256-LBGA (FBGA), 1 mm ball pitch |
| Core Voltage | — | 1.5 V |
| Maximum System Frequency | — | 1098.9 MHz (per distributor parametric listing) |
| Embedded Processor | — | ARM CoreMP7 |
| Fabric Type | — | Flash-based, non-volatile, instant-on |
| Analog Subsystem | — | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | — | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Clock Management | — | Integrated clock generation and management circuitry (PLLs) |
| Temperature Grade | — | Industrial (I suffix) |
| Operating Temperature Range | — | -40C to +85C (industrial grade standard range) |
| Packaging | — | Tray |
| MSL Level | — | [DATA_NEEDED: MSL Level] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: Thermal Resistance] |