M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
MPN: M7AFS600-FGG256I ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for M7AFS600-FGG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M7AFS600-FGG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$232.4 / Unit
View Datasheet →M7AFS600-1FGG256
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$92 / Unit
View Datasheet →M7AFS600-FG256I
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Contact for price
View Datasheet →AFS600-FGG256I
✅ Drop-In📋 Reference alternative (not in catalog)
M7AFS600-FGG256I Maximum Ratings & Electrical Characteristics
| Family | Fusion Mixed-Signal FPGA |
| System Gates | 600K |
| User I/O | 119 |
| Package | 256-LBGA (FBGA), 1 mm ball pitch |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) |
| Embedded Processor | ARM CoreMP7 |
| Fabric Type | Flash-based, non-volatile, instant-on |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Clock Management | Integrated clock generation and management circuitry (PLLs) |
| Temperature Grade | Industrial (I suffix) |
| Operating Temperature Range | -40C to +85C (industrial grade standard range) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
M7AFS600-FGG256I 256-lbga (fbga), 1 mm ball pitch Pin Configuration Guide
Complete pinout information for M7AFS600-FGG256I (256-lbga (fbga), 1 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-FGG256I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-FGG256I is suitable for 6 applications: Industrial System Monitoring and Control, Embedded ARM-Based Control Node, Smart Power Supply Supervision, Secure and Configuration-Immune Logic, Clock Generation and Distribution Management, Legacy System Sustainment and EOL Re-sourcing.
Industrial System Monitoring and Control
The M7AFS600-FGG256I fits industrial monitoring nodes because its flash-based fabric is instant-on and configuration-immune, while the integrated analog subsystem performs on-die voltage, current, and temperature conversion, eliminating external supervisory ICs. The 600K gates and ARM CoreMP7 processor allow deterministic control loops and protocol bridging (e.g., industrial fieldbus to local sensing) within one 256-LBGA package. Placed as the supervisory device on a backplane, its industrial -40C to +85C grade and non-volatile configuration survive power cycling without a bootloader or external configuration flash. The trade-off versus modern SRAM FPGAs is fabric size; designs needing heavy DSP should split logic between the Fusion and companion devices.
Recommended
Embedded ARM-Based Control Node
The embedded ARM CoreMP7 processor makes the M7AFS600-FGG256I a single-chip embedded controller: the processor runs firmware from the integrated flash memory blocks while custom logic handles peripherals and interfaces. Because the flash fabric is non-volatile, the processor and logic are functional within microseconds of power application, removing the SRAM-FPGA boot sequencing problem entirely. In a typical design the CoreMP7 executes control and communication stacks at its rated clock while the 600K-gate fabric implements UART/SPI/CAN-style interfaces and state machines. Designers should budget the 119 user I/Os early, since the FGG256 package offers fewer I/Os than the 172-I/O FGG484 variant of the same die.
Recommended
Smart Power Supply Supervision
The Fusion analog subsystem was designed specifically for power-supply supervision: on-chip ADC channels monitor rail voltages, currents via sense resistors, and board temperature, while the digital fabric implements fault thresholds, sequencing state machines, and PMBus-style communication. The M7AFS600-FGG256I replaces a discrete supervisor plus an FPGA plus an MCU with one 1.5V-core device in a 256-LBGA. Because configuration is flash-based, protection logic is active immediately at power-up, a critical property for hot-swap and sequencing applications where SRAM FPGAs are blind during configuration. Performance consideration: verify ADC channel count against your rail count before committing the analog budget.
Recommended
Secure and Configuration-Immune Logic
Flash-based FPGAs are inherently resistant to bitstream-interception attacks because there is no external configuration bitstream to capture at boot - the configuration resides on-chip in non-volatile flash. For industrial and defense-adjacent equipment where design IP protection matters, the M7AFS600-FGG256I provides this security property together with the ARM CoreMP7 for secure application code. Compared with SRAM FPGAs that require encrypted bitstreams and battery-backed keys, the Fusion approach removes the attack surface entirely. The trade-off is the older 130nm process and 119 user I/Os, so high-volume or high-I/O secure designs may combine the Fusion with a larger companion FPGA.
Recommended
Clock Generation and Distribution Management
The Fusion family integrates comprehensive clock generation and management circuitry, including PLLs, making the M7AFS600-FGG256I suitable as a system clock-conditioning hub: it can synthesize, divide, phase-shift, and distribute multiple clock domains to surrounding ASICs and processors while monitoring power and temperature via its analog subsystem. In this role the device typically receives a reference clock, generates derived domains through its PLL blocks, and enforces enable/disable sequencing through the flash fabric, which is active instantly at power-up. Distributor parametric data lists a maximum system frequency of approximately 1098.9 MHz for this family, providing headroom for high-speed clock-domain handling.
Recommended
Legacy System Sustainment and EOL Re-sourcing
Many fielded industrial and communications systems were designed around Actel/Microsemi Fusion parts now in allocation; the M7AFS600-FGG256I remains listed as active at DigiKey and Mouser as of 2026-09-02, making it a sustainment source for existing designs. Same-package family members (M7AFS600-FGG256, M7AFS600-1FGG256, M7AFS600-FG256I) allow procurement flexibility on temperature grade, speed grade, and finish without any PCB change, since all share the 256-LBGA footprint and identical die. Engineers re-sourcing should recompile the Libero project against the chosen ordering code and re-verify timing at the new speed grade, a typically low-risk activity within one family.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-FGG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-FGG256 | M7AFS600-1FGG256 | M7AFS600-FG256I | AFS600-FGG256I |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LBGA (FBGA) | 256-LBGA - same footprint | 256-LBGA - same footprint | 256-FBGA - same footprint | 256-LBGA - same footprint |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| User I/O | 119 | 119 | 119 | 119 | 119 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Speed Grade | Standard (-) | Standard (-) | -1 (faster) | Standard (-) | Standard (-) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded Processor | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 |
| Fabric Type | Flash-based, non-volatile (130 nm) | Flash-based, 130 nm | Flash-based, 130 nm | Flash-based, 130 nm | Flash-based, 130 nm |
Key Differentiators
- Monolithic analog subsystem plus FPGA fabric (vs M7AFS600-1FGG256)
- Instant-on non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx/Altera equivalents))
- Trade-off: 119 user I/Os limits system expansion (vs M7AFS600-FGG484)
- Cost-optimized industrial sourcing flexibility (vs AFS600-FGG256I)
Design Notes
The M7AFS600-FGG256I uses a 1.5V core supply plus separate I/O bank supplies; follow the Fusion datasheet power-up sequencing requirements, since flash-based fabrics are instant-on but analog subsystem accuracy depends on settled rails. Estimated power dissipation must be calculated with Microchip's Fusion power calculator using your actual utilization, toggle rates, and I/O loading - do not rely on generic numbers. Provide adequate decoupling (bulk plus 0.1 uF ceramics per supply pin bank) and verify the industrial -40C to +85C ambient budget against calculated junction temperature once theta_JA is confirmed from the datasheet mechanical data.
The FGG256 package exposes only 119 user I/Os versus 172 on the FGG484 variant of the same die; designs ported between the two packages routinely fail at the pin-planning stage. Before committing the PCB, complete pin assignment in Libero SoC and check bank voltage compatibility - mixing 3.3V and 2.5V I/O standards requires grouping within correct banks. Also note the naming trap: FG256 (standard finish) and FGG256 (Pb-free finish) share a footprint but are distinct ordering codes; and the commercial-grade M7AFS600-FGG256 lacks the -40C rating, which is invalid for industrial deployments.
Use a 1 mm-pitch, 256-ball BGA escape pattern: dogbone vias with 0.3 mm drill for the outer two ball rows, and via-in-pad with filled/capped vias for the inner rows to guarantee yield. The 256-LBGA footprint must match the Fusion FGG256 ball map exactly from the Libero-generated package file - never copy from a different Microsemi package. For the analog subsystem channels, keep sense routing short and Kelvin-connect current-sense lines. Reference Microchip Fusion board-design application notes for recommended stackup and ball-map escape guidelines.
Compliance Information
FGG package suffix conventionally denotes Pb-free finish in Microchip naming, but explicit RoHS/REACH status was not stated in the retrieved web data and is therefore marked unknown; verify on the official Microchip product page.
