AFS600-FG256I vs M7AFS600-FGG256I 对比

详细并排对比 AFS600-FG256I 出自 Microchip Technology 和 M7AFS600-FGG256I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
AFS600-FG256I AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology

AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology

AFS600-FG256I ✓ 量产中
Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ 量产中

规格对比

参数 AFS600-FG256I M7AFS600-FGG256I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Device Type Fusion mixed-signal FPGA —
System Gates 600,000 gates 600K
Configurable Logic Blocks 13,824 CLBs —
User I/O 119 I/O 119
电源电压 1.5 V —
Process Technology 130 nm CMOS 130 nm
Metal Layers 7 layers —
Configuration Memory Nonvolatile flash memory —
Power-Up Feature Live at Power-Up (LAPU) —
Logic Family CMOS —
Package Type 256-LBGA —
Package Pitch 1.0 mm —
Number of Package Balls 256 balls —
Package Shape Square —
安装类型 Surface mount Surface Mount
工作温度 0 C to 70 C —
RoHS 状态 [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Family — Fusion Mixed-Signal FPGA
封装 — 256-LBGA (FBGA), 1 mm ball pitch
Core Voltage — 1.5 V
Maximum System Frequency — 1098.9 MHz (per distributor parametric listing)
Embedded Processor — ARM CoreMP7
Fabric Type — Flash-based, non-volatile, instant-on
Analog Subsystem — Integrated configurable analog (per Microchip Fusion family page)
On-chip Flash Memory — Yes (large flash memory blocks, per Microchip Fusion family page)
Clock Management — Integrated clock generation and management circuitry (PLLs)
Temperature Grade — Industrial (I suffix)
工作温度范围 — -40C to +85C (industrial grade standard range)
Packaging — Tray
MSL 等级 — [DATA_NEEDED: MSL Level]
Thermal Resistance (theta_JA) — [DATA_NEEDED: Thermal Resistance]

数据手册与资源

浏览全部产品 创建 BOM 获取报价