AFS600-FGG256 vs M7AFS600-FGG256I Comparison

Detailed side-by-side comparison of AFS600-FGG256 by Microchip Technology and M7AFS600-FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
AFS600-FGG256 AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 Unknown
Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ Active

Specification Comparison

Parameter AFS600-FGG256 M7AFS600-FGG256I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Active
Device Type Fusion mixed-signal FPGA —
System Gates 600,000 gates 600K
Configurable Logic Cells 13,824 cells —
I/O Count 119 I/Os —
Supply Voltage 1.5 V —
Logic Family CMOS —
Process Technology 130 nm 130 nm
Metal Layers 7 layers —
Configuration Memory Flash-based nonvolatile memory —
Configuration Feature Live at Power-Up (LAPU) —
Maximum Clock Frequency 1098.9 MHz —
Operating Temperature 0°C to 70°C —
Package Type 256-pin FBGA —
Package Pitch 1.0 mm —
Mounting Type Surface mount Surface Mount
Packing Media Tray —
RoHS Compliant —
Family — Fusion Mixed-Signal FPGA
User I/O — 119
Package — 256-LBGA (FBGA), 1 mm ball pitch
Core Voltage — 1.5 V
Maximum System Frequency — 1098.9 MHz (per distributor parametric listing)
Embedded Processor — ARM CoreMP7
Fabric Type — Flash-based, non-volatile, instant-on
Analog Subsystem — Integrated configurable analog (per Microchip Fusion family page)
On-chip Flash Memory — Yes (large flash memory blocks, per Microchip Fusion family page)
Clock Management — Integrated clock generation and management circuitry (PLLs)
Temperature Grade — Industrial (I suffix)
Operating Temperature Range — -40C to +85C (industrial grade standard range)
Packaging — Tray
MSL Level — [DATA_NEEDED: MSL Level]
Thermal Resistance (theta_JA) — [DATA_NEEDED: Thermal Resistance]

Datasheets & Resources

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