AFS600-FGG256 vs M7AFS600-FGG256I 비교
다음의 상세 나란히 비교: AFS600-FGG256 제조: Microchip Technology 및 M7AFS600-FGG256I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ 활성사양 비교
| 파라미터 | AFS600-FGG256 | M7AFS600-FGG256I |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Unknown | 활성 |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600K |
| Configurable Logic Cells | 13,824 cells | — |
| I/O Count | 119 I/Os | — |
| 공급 전압 | 1.5 V | — |
| Logic Family | CMOS | — |
| Process Technology | 130 nm | 130 nm |
| Metal Layers | 7 layers | — |
| Configuration Memory | Flash-based nonvolatile memory | — |
| Configuration Feature | Live at Power-Up (LAPU) | — |
| 최대 클록 주파수 | 1098.9 MHz | — |
| 동작 온도 | 0°C to 70°C | — |
| Package Type | 256-pin FBGA | — |
| Package Pitch | 1.0 mm | — |
| 실장 유형 | Surface mount | Surface Mount |
| Packing Media | Tray | — |
| RoHS | Compliant | — |
| Family | — | Fusion Mixed-Signal FPGA |
| User I/O | — | 119 |
| 패키지 | — | 256-LBGA (FBGA), 1 mm ball pitch |
| Core Voltage | — | 1.5 V |
| Maximum System Frequency | — | 1098.9 MHz (per distributor parametric listing) |
| Embedded Processor | — | ARM CoreMP7 |
| Fabric Type | — | Flash-based, non-volatile, instant-on |
| Analog Subsystem | — | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | — | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Clock Management | — | Integrated clock generation and management circuitry (PLLs) |
| Temperature Grade | — | Industrial (I suffix) |
| 동작 온도 범위 | — | -40C to +85C (industrial grade standard range) |
| Packaging | — | Tray |
| MSL 레벨 | — | [DATA_NEEDED: MSL Level] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: Thermal Resistance] |