AFS600-FGG256I vs M7AFS600-FGG256I Comparison

Detailed side-by-side comparison of AFS600-FGG256I by Microchip Technology and M7AFS600-FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
AFS600-FGG256I AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology

AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology

AFS600-FGG256I ✓ Active
Microchip Technology
M7AFS600-FGG256I M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip

M7AFS600-FGG256I ✓ Active

Specification Comparison

Parameter AFS600-FGG256I M7AFS600-FGG256I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
System Gates 600,000 gates 600K
Device Type Fusion mixed-signal FPGA —
Process Technology 130 nm CMOS 130 nm
Metal Layers 7 layers —
Configuration Memory Nonvolatile flash —
Power-Up Configuration Live at Power-Up (LAPU) —
System Performance Frequency 350 MHz —
Supply Voltage 1.5 V —
Logic Family CMOS —
Total Pin Count 256 pins —
Package Type BGA-256 —
Package Pitch 1.0 mm —
Package Form Square —
Terminal Type Ball —
Operating Temperature 0°C to +70°C —
Temperature Grade Industrial Industrial (I suffix)
Programmable Analog Resources Configurable analog blocks —
Embedded Flash Large flash memory blocks —
Clock Management Comprehensive clock generation and management circuitry Integrated clock generation and management circuitry (PLLs)
Programming Interface [DATA_NEEDED: programming interface] —
I/O Standards [DATA_NEEDED: supported I/O standards] —
Maximum I/O Current [DATA_NEEDED: maximum I/O current] —
Junction Temperature [DATA_NEEDED: junction temperature rating] —
Family — Fusion Mixed-Signal FPGA
User I/O — 119
Package — 256-LBGA (FBGA), 1 mm ball pitch
Core Voltage — 1.5 V
Maximum System Frequency — 1098.9 MHz (per distributor parametric listing)
Embedded Processor — ARM CoreMP7
Fabric Type — Flash-based, non-volatile, instant-on
Analog Subsystem — Integrated configurable analog (per Microchip Fusion family page)
On-chip Flash Memory — Yes (large flash memory blocks, per Microchip Fusion family page)
Operating Temperature Range — -40C to +85C (industrial grade standard range)
Mounting Type — Surface Mount
Packaging — Tray
MSL Level — [DATA_NEEDED: MSL Level]
Thermal Resistance (theta_JA) — [DATA_NEEDED: Thermal Resistance]

Datasheets & Resources

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