AFS600-FGG256I vs M7AFS600-FGG256I Comparação
Comparação detalhada lado a lado de AFS600-FGG256I por Microchip Technology e M7AFS600-FGG256I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology
AFS600-FGG256I ✓ AtivoMicrochip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ AtivoComparação de especificações
| Parâmetro | AFS600-FGG256I | M7AFS600-FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| System Gates | 600,000 gates | 600K |
| Device Type | Fusion mixed-signal FPGA | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash | — |
| Power-Up Configuration | Live at Power-Up (LAPU) | — |
| System Performance Frequency | 350 MHz | — |
| Tensão de alimentação | 1.5 V | — |
| Logic Family | CMOS | — |
| Total Pin Count | 256 pins | — |
| Package Type | BGA-256 | — |
| Package Pitch | 1.0 mm | — |
| Package Form | Square | — |
| Terminal Type | Ball | — |
| Temperatura de operação | 0°C to +70°C | — |
| Temperature Grade | Industrial | Industrial (I suffix) |
| Programmable Analog Resources | Configurable analog blocks | — |
| Embedded Flash | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | Integrated clock generation and management circuitry (PLLs) |
| Programming Interface | [DATA_NEEDED: programming interface] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Maximum I/O Current | [DATA_NEEDED: maximum I/O current] | — |
| Junction Temperature | [DATA_NEEDED: junction temperature rating] | — |
| Family | — | Fusion Mixed-Signal FPGA |
| User I/O | — | 119 |
| Encapsulamento | — | 256-LBGA (FBGA), 1 mm ball pitch |
| Core Voltage | — | 1.5 V |
| Maximum System Frequency | — | 1098.9 MHz (per distributor parametric listing) |
| Embedded Processor | — | ARM CoreMP7 |
| Fabric Type | — | Flash-based, non-volatile, instant-on |
| Analog Subsystem | — | Integrated configurable analog (per Microchip Fusion family page) |
| On-chip Flash Memory | — | Yes (large flash memory blocks, per Microchip Fusion family page) |
| Faixa de temperatura de operação | — | -40C to +85C (industrial grade standard range) |
| Tipo de montagem | — | Surface Mount |
| Packaging | — | Tray |
| Nível MSL | — | [DATA_NEEDED: MSL Level] |
| Thermal Resistance (theta_JA) | — | [DATA_NEEDED: Thermal Resistance] |