ATSAMA5D31A-CUR vs ATSAMA5D27A-CUR Comparison

Detailed side-by-side comparison of ATSAMA5D31A-CUR by Microchip Technology and ATSAMA5D27A-CUR by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
ATSAMA5D31A-CUR ATSAMA5D31A-CUR - 536MHz ARM Cortex-A5 MPU 324-LFBGA | Microchip

ATSAMA5D31A-CUR - 536MHz ARM Cortex-A5 MPU 324-LFBGA | Microchip

ATSAMA5D31A-CUR βœ“ Active
Microchip Technology
ATSAMA5D27A-CUR ATSAMA5D27A-CUR - 500MHz ARM Cortex-A5 MPU | Microchip

ATSAMA5D27A-CUR - 500MHz ARM Cortex-A5 MPU | Microchip

ATSAMA5D27A-CUR βœ“ Active

Specification Comparison

Parameter ATSAMA5D31A-CUR ATSAMA5D27A-CUR
Brand Microchip Technology Microchip Technology
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $12.85 $12.95
Core Architecture ARM Cortex-A5 (32-bit) with FPU β€”
Maximum CPU Clock 536 MHz 500 MHz
L1 Instruction Cache 32 KB 32 KB
L1 Data Cache 32 KB 32 KB
Internal SRAM 128 KB β€”
Core Supply Voltage 1.2 V (typ) β€”
I/O Supply Voltage 1.8 V / 3.3 V β€”
Package 324-LFBGA (15 mm x 15 mm) 289-LFBGA (14x14 mm)
Operating Temperature -40 C to +85 C (industrial) -40 C to +85 C (Industrial, MRLA marking)
External Memory Interface DDR2 / LPDDR2 (16-bit) β€”
Ethernet 2x 10/100/1000 MAC with IEEE 1588 β€”
USB 2x USB 2.0 High-Speed Host + Device β€”
Display Controller Integrated LCD controller β€”
Operating System Support Linux, Buildroot, OpenWrt β€”
RoHS Status Compliant Compliant
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Series β€” SAMA5D2
Core β€” ARM Cortex-A5 (1 core, 32-bit)
Maximum Junction Temperature β€” 105 C
Ball Pitch β€” 0.8 mm
External Memory Support β€” DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC
Cache β€” 32 KB I-cache, 32 KB D-cache
FPU / NEON β€” Yes (VFPv4 + NEON)
AES-OTF (On-The-Fly) β€” Yes
CAN-FD Controllers β€” 2
HSIC Interface β€” Yes
Peripheral Touch Controller β€” Yes (PTC)
Backup Mode Current β€” 5 uA (typ)
Packaging β€” Tape & Reel (TR)
MSL Level β€” 3
Embedded Audio Subsystem β€” Yes (I2S/TDM)

Datasheets & Resources

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