BSC9131NJN1HHHB557 vs BSC9131NLN1HHHB Comparison
Detailed side-by-side comparison of BSC9131NJN1HHHB557 by NXP Semiconductors and BSC9131NLN1HHHB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | BSC9131NJN1HHHB557 | BSC9131NLN1HHHB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Unknown |
| Processor Type | QorIQ Qonverge multicore baseband processor | — |
| Processor Category | Embedded MPU / communications processor | — |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | — |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Mounting Type | Surface Mount | Surface mount |
| Core Count | [DATA_NEEDED: core count] | 1 core |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | 0°C to 105°C |
| Thermal Resistance | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| RoHS Status | Compliant | RoHS compliant |
| Lifecycle Status | Active; in-stock listing reported by LCSC | — |
| Manufacturer | NXP Semiconductors | — |
| Product Type | — | QorIQ Qonverge system-on-chip |
| Processor Core | — | PowerPC e500, 32-bit |
| Processor Frequency | — | 800 MHz |
| Digital Signal Processor | — | 800 MHz StarCore DSP |
| Accelerator | — | MAPLE-B2F accelerator |
| Communications Interface | — | Integrated IFC |
| External Memory Support | — | DDR3 |
| Package | — | 520-FCBGA (21 mm x 21 mm) |
| Pin Count | — | 520 balls |
| Architecture | — | 32-bit |
| Qualification | — | Military and defense target application; qualification status [DATA_NEEDED: exact device qualification status] |
| Packaging Form | — | Multiple dry pack, bakeable tray |
| Observed LCSC Price | — | $36.6899 as of 2026-10-23 |
| Observed Heisener Price | — | $56.6250 per unit as of 2026-10-23 |
| Observed Heisener Stock | — | 4,928 pieces as of 2026-10-23 |