BSC9131NJN1HHHB557 vs BSC9131NLN1HHHB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci BSC9131NJN1HHHB557 disebabkan oleh NXP Semiconductors dan BSC9131NLN1HHHB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | BSC9131NJN1HHHB557 | BSC9131NLN1HHHB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Unknown |
| Processor Type | QorIQ Qonverge multicore baseband processor | — |
| Processor Category | Embedded MPU / communications processor | — |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | — |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Jenis Pemasangan | Surface Mount | Surface mount |
| Core Count | [DATA_NEEDED: core count] | 1 core |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: operating temperature range] | 0°C to 105°C |
| Tegangan Panas | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| Status RoHS | Compliant | RoHS compliant |
| Status Lingkungan Hidup | Active; in-stock listing reported by LCSC | — |
| Manufacturer | NXP Semiconductors | — |
| Product Type | — | QorIQ Qonverge system-on-chip |
| Processor Core | — | PowerPC e500, 32-bit |
| Processor Frequency | — | 800 MHz |
| Digital Signal Processor | — | 800 MHz StarCore DSP |
| Accelerator | — | MAPLE-B2F accelerator |
| Communications Interface | — | Integrated IFC |
| External Memory Support | — | DDR3 |
| Kemasan | — | 520-FCBGA (21 mm x 21 mm) |
| Kiraan Pin | — | 520 balls |
| Architecture | — | 32-bit |
| Qualification | — | Military and defense target application; qualification status [DATA_NEEDED: exact device qualification status] |
| Packaging Form | — | Multiple dry pack, bakeable tray |
| Observed LCSC Price | — | $36.6899 as of 2026-10-23 |
| Observed Heisener Price | — | $56.6250 per unit as of 2026-10-23 |
| Observed Heisener Stock | — | 4,928 pieces as of 2026-10-23 |