BSC9131NJN1HHHB557 vs BSC9131NLN1HHHB Comparação
Comparação detalhada lado a lado de BSC9131NJN1HHHB557 por NXP Semiconductors e BSC9131NLN1HHHB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | BSC9131NJN1HHHB557 | BSC9131NLN1HHHB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Unknown |
| Processor Type | QorIQ Qonverge multicore baseband processor | — |
| Processor Category | Embedded MPU / communications processor | — |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | — |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Tipo de montagem | Surface Mount | Surface mount |
| Core Count | [DATA_NEEDED: core count] | 1 core |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Faixa de temperatura de operação | [DATA_NEEDED: operating temperature range] | 0°C to 105°C |
| Resistência térmica | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| Status RoHS | Compliant | RoHS compliant |
| Status do ciclo de vida | Active; in-stock listing reported by LCSC | — |
| Manufacturer | NXP Semiconductors | — |
| Product Type | — | QorIQ Qonverge system-on-chip |
| Processor Core | — | PowerPC e500, 32-bit |
| Processor Frequency | — | 800 MHz |
| Digital Signal Processor | — | 800 MHz StarCore DSP |
| Accelerator | — | MAPLE-B2F accelerator |
| Communications Interface | — | Integrated IFC |
| External Memory Support | — | DDR3 |
| Encapsulamento | — | 520-FCBGA (21 mm x 21 mm) |
| Contagem de pinos | — | 520 balls |
| Architecture | — | 32-bit |
| Qualification | — | Military and defense target application; qualification status [DATA_NEEDED: exact device qualification status] |
| Packaging Form | — | Multiple dry pack, bakeable tray |
| Observed LCSC Price | — | $36.6899 as of 2026-10-23 |
| Observed Heisener Price | — | $56.6250 per unit as of 2026-10-23 |
| Observed Heisener Stock | — | 4,928 pieces as of 2026-10-23 |