BSC9132NSN7MNMB vs BSC9132NSE7MNMB Comparison
Detailed side-by-side comparison of BSC9132NSN7MNMB by NXP Semiconductors and BSC9132NSE7MNMB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
BSC9132NSN7MNMB - QorIQ Qonverge SoC 2x1.2GHz StarCore/e500 | NXP
BSC9132NSN7MNMB NrndNXP Semiconductors
BSC9132NSE7MNMB - QorIQ Qonverge SoC, 1.333GHz, FCBGA-780 | NXP
BSC9132NSE7MNMB ✓ ActiveSpecification Comparison
| Parameter | BSC9132NSN7MNMB | BSC9132NSE7MNMB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $124.50 | $218.75 |
| Architecture | QorIQ Qonverge SoC | QorIQ Qonverge BSC |
| CPU Cores | 2 x Power Architecture e500 (32-bit) up to 1.333 GHz | 2x PowerPC e500, 1.2 GHz |
| DSP Cores | 2 x StarCore SC3850 up to 1.2 GHz | 2x StarCore SC3850, 1.2 GHz |
| Hardware Accelerator | MAPLE-B2P (LTE baseband) | — |
| Physical Addressing | 36-bit | — |
| Memory Controller | DDR3 / DDR3L with ECC support | — |
| Ethernet | Multiple 10/100/1000 MAC interfaces | — |
| High-Speed Serial | PCI Express, RapidIO, SerDes | — |
| Operating Temperature | 0 °C to +105 °C | 0C to +105C |
| Package | 780-FCBGA (23 mm x 23 mm) | 780-pin FCBGA (23x23 mm) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | 3 (per Partstack listing) |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant (per DigiKey) |
| Supply Voltage | [DATA_NEEDED: core/rail voltage levels] | — |
| Product Type | — | Multicore Baseband SoC (MPU + DSP) |
| Max Core Frequency | — | 1.333 GHz |
| Baseband Accelerator | — | MAPLE-B2P (Turbo + Viterbi + FEC) |
| Security Engine | — | SEC (Integrated) |
| Process Technology | — | 45 nm CMOS |
| Peak Reflow Temperature | — | 245C (per Partstack listing) |
| Lead-Free / Solder Finish | — | e1 (per Partstack listing) |
| Data Bus Width | — | 32-bit |