BSC9132NSN7MNMB vs BSC9132NSE7MNMB Comparaison
Comparaison détaillée côte à côte de BSC9132NSN7MNMB par NXP Semiconductors et BSC9132NSE7MNMB par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
BSC9132NSN7MNMB - QorIQ Qonverge SoC 2x1.2GHz StarCore/e500 | NXP
BSC9132NSN7MNMB NrndNXP Semiconductors
BSC9132NSE7MNMB - QorIQ Qonverge SoC, 1.333GHz, FCBGA-780 | NXP
BSC9132NSE7MNMB ✓ ActifComparaison des spécifications
| Paramètre | BSC9132NSN7MNMB | BSC9132NSE7MNMB |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $124,50 | $218,75 |
| Architecture | QorIQ Qonverge SoC | QorIQ Qonverge BSC |
| CPU Cores | 2 x Power Architecture e500 (32-bit) up to 1.333 GHz | 2x PowerPC e500, 1.2 GHz |
| DSP Cores | 2 x StarCore SC3850 up to 1.2 GHz | 2x StarCore SC3850, 1.2 GHz |
| Hardware Accelerator | MAPLE-B2P (LTE baseband) | — |
| Physical Addressing | 36-bit | — |
| Memory Controller | DDR3 / DDR3L with ECC support | — |
| Ethernet | Multiple 10/100/1000 MAC interfaces | — |
| High-Speed Serial | PCI Express, RapidIO, SerDes | — |
| Température de fonctionnement | 0 °C to +105 °C | 0C to +105C |
| Boîtier | 780-FCBGA (23 mm x 23 mm) | 780-pin FCBGA (23x23 mm) |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | 3 (per Partstack listing) |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (per DigiKey) |
| Tension d'alimentation | [DATA_NEEDED: core/rail voltage levels] | — |
| Product Type | — | Multicore Baseband SoC (MPU + DSP) |
| Max Core Frequency | — | 1.333 GHz |
| Baseband Accelerator | — | MAPLE-B2P (Turbo + Viterbi + FEC) |
| Security Engine | — | SEC (Integrated) |
| Process Technology | — | 45 nm CMOS |
| Peak Reflow Temperature | — | 245C (per Partstack listing) |
| Lead-Free / Solder Finish | — | e1 (per Partstack listing) |
| Largeur du bus de données | — | 32-bit |