BSC9132NSN7MNMB vs BSC9132NSE7MNMB Vergleich
Detaillierter Direktvergleich von BSC9132NSN7MNMB von NXP Semiconductors und BSC9132NSE7MNMB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
BSC9132NSN7MNMB - QorIQ Qonverge SoC 2x1.2GHz StarCore/e500 | NXP
BSC9132NSN7MNMB NrndNXP Semiconductors
BSC9132NSE7MNMB - QorIQ Qonverge SoC, 1.333GHz, FCBGA-780 | NXP
BSC9132NSE7MNMB ✓ AktivSpezifikationsvergleich
| Parameter | BSC9132NSN7MNMB | BSC9132NSE7MNMB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $124,50 | $218,75 |
| Architecture | QorIQ Qonverge SoC | QorIQ Qonverge BSC |
| CPU Cores | 2 x Power Architecture e500 (32-bit) up to 1.333 GHz | 2x PowerPC e500, 1.2 GHz |
| DSP Cores | 2 x StarCore SC3850 up to 1.2 GHz | 2x StarCore SC3850, 1.2 GHz |
| Hardware Accelerator | MAPLE-B2P (LTE baseband) | — |
| Physical Addressing | 36-bit | — |
| Memory Controller | DDR3 / DDR3L with ECC support | — |
| Ethernet | Multiple 10/100/1000 MAC interfaces | — |
| High-Speed Serial | PCI Express, RapidIO, SerDes | — |
| Betriebstemperatur | 0 °C to +105 °C | 0C to +105C |
| Gehäuse | 780-FCBGA (23 mm x 23 mm) | 780-pin FCBGA (23x23 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | 3 (per Partstack listing) |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant (per DigiKey) |
| Versorgungsspannung | [DATA_NEEDED: core/rail voltage levels] | — |
| Product Type | — | Multicore Baseband SoC (MPU + DSP) |
| Max Core Frequency | — | 1.333 GHz |
| Baseband Accelerator | — | MAPLE-B2P (Turbo + Viterbi + FEC) |
| Security Engine | — | SEC (Integrated) |
| Process Technology | — | 45 nm CMOS |
| Peak Reflow Temperature | — | 245C (per Partstack listing) |
| Lead-Free / Solder Finish | — | e1 (per Partstack listing) |
| Datenbusbreite | — | 32-bit |