EP1AGX35DF780I5N vs EP1AGX35DF780I6 Comparison

Detailed side-by-side comparison of EP1AGX35DF780I5N by Intel and EP1AGX35DF780I6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1AGX35DF780I5N EP1AGX35DF780I6
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $225.00 $175.00
Family Arria GX Arria GX
Logic Elements 33,520 —
Embedded Memory (Bits) 1,348,416 —
Logic Array Blocks (LABs) 1,676 —
Maximum User I/O Pins 341 —
Transceiver Channels 8 —
Maximum Transceiver Data Rate 3.125 Gbps —
PLLs 4 —
Global Clocks 16 —
Package 780-ball FineLine BGA (FBGA) —
Process Technology 90 nm 90 nm
Speed Grade I5 (industrial) I6 (industrial)
Operating Junction Temperature -40 C to +100 C (industrial) —
Configuration Method Passive Serial / FPP / JTAG —
Bitstream Encryption AES-128 supported —
Memory Interface Hard IP DDR2, QDRII, RLDRAM II —
DSP Blocks (18x18 multipliers) Max 252 —
RoHS Status Compliant Contains lead / RoHS non-compliant (per third-party distributor)
Series — Arria GX
Logic Elements / Cells — 33,520
Number of LABs/CLBs — 1676
Number of Logic Elements — 33,520
Total RAM Bits — [DATA_NEEDED: total embedded memory bits]
Number of I/O — 341
Number of Transceivers — Up to 4 channels
Transceiver Data Rate — Up to 3.125 Gbps
Voltage - Supply (Core) — 1.2 V
Operating Temperature — -40C to +100C (industrial, I6 speed grade)
Mounting Type — Surface Mount
Package / Case — 780-BGA, FC-FBGA
Package Size — 29 mm x 29 mm, 1.0 mm pitch
Maximum Internal Frequency — 640 MHz
Lead Free Status — Contains lead

Datasheets & Resources

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