EP1AGX35DF780I5N vs EP1AGX35DF780I6 Vergleich

Detaillierter Direktvergleich von EP1AGX35DF780I5N von Intel und EP1AGX35DF780I6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1AGX35DF780I5N EP1AGX35DF780I6
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $225,00 $175,00
Family Arria GX Arria GX
Logic Elements 33,520 —
Embedded Memory (Bits) 1,348,416 —
Logic Array Blocks (LABs) 1,676 —
Maximum User I/O Pins 341 —
Transceiver Channels 8 —
Maximum Transceiver Data Rate 3.125 Gbps —
PLLs 4 —
Global Clocks 16 —
Gehäuse 780-ball FineLine BGA (FBGA) —
Process Technology 90 nm 90 nm
Speed Grade I5 (industrial) I6 (industrial)
Betriebs-Sperrschichttemperatur -40 C to +100 C (industrial) —
Configuration Method Passive Serial / FPP / JTAG —
Bitstream Encryption AES-128 supported —
Memory Interface Hard IP DDR2, QDRII, RLDRAM II —
DSP Blocks (18x18 multipliers) Max 252 —
RoHS-Status Compliant Contains lead / RoHS non-compliant (per third-party distributor)
Series — Arria GX
Logic Elements / Cells — 33,520
Number of LABs/CLBs — 1676
Number of Logic Elements — 33,520
Total RAM Bits — [DATA_NEEDED: total embedded memory bits]
Number of I/O — 341
Number of Transceivers — Up to 4 channels
Transceiver Data Rate — Up to 3.125 Gbps
Voltage - Supply (Core) — 1.2 V
Betriebstemperatur — -40C to +100C (industrial, I6 speed grade)
Montageart — Surface Mount
Gehäuse / Bauform — 780-BGA, FC-FBGA
Package Size — 29 mm x 29 mm, 1.0 mm pitch
Maximum Internal Frequency — 640 MHz
Lead Free Status — Contains lead

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