EP1AGX50DF780C6 vs EP1AGX50DF780I6N Comparison
Detailed side-by-side comparison of EP1AGX50DF780C6 by Intel and EP1AGX50DF780I6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1AGX50DF780C6 | EP1AGX50DF780I6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $205.00 | $255.00 |
| Family | Arria GX | Arria GX |
| Logic Elements | 50,160 | — |
| Logic Array Blocks (LABs) | 2,508 | 2,508 |
| Embedded Memory (bits) | 2,475,072 | — |
| User I/O Count | 350 | — |
| Package | 780-pin FBGA (FineLine BGA) | 780-pin FBGA (FineLine BGA) |
| Speed Grade | C6 | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Transceiver Data Rate (max) | Up to 3.125 Gbps | — |
| Hard PCI Express IP | Yes (x1/x4 endpoint and root port, PCIe 1.0) | — |
| Embedded Multipliers | 18x18 multipliers | Yes (DSP blocks, 18x18) |
| Process Technology | 90 nm | CMOS, 1.2V core |
| Configuration Modes | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) | — |
| Supply Voltage (Core) | 1.2 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI, PCI-X | — |
| RoHS Status | Non-Compliant (per Besenchips listing - contains lead) | Compliant |
| Logic Elements (LEs) | — | 50,160 |
| User I/O Pins | — | 350 |
| Mounting Type | — | Surface Mount |
| Operating Temperature Grade | — | Industrial (I6, -40C to +100C junction) |
| Configuration Mode | — | Serial / Parallel / JTAG |
| Embedded Transceivers | — | Yes (multi-channel, protocol-specific) |
| Embedded Memory | — | [DATA_NEEDED: total Mbits and block size] |
| MSL Level | — | [DATA_NEEDED: MSL rating] |
| Lead-Free / Halogen-Free | — | Lead-free per Intel datasheet |
| Supply Voltage | — | 1.2V core (with auxiliary rails per datasheet) |