EP1AGX50DF780C6 - Arria GX FPGA, 50K LE, 780-FBGA | Intel
MPN: EP1AGX50DF780C6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $205 | $205,000.00 |
Drop-in alternatives for EP1AGX50DF780C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX50DF780C7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1AGX50DF780I6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$255 / Unit
View Datasheet →EP1AGX50DF780C5N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1AGX35DF780C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$199.5 / Unit
View Datasheet →EP1AGX35DF780I6N
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View Datasheet →EP1AGX50DF780C6 Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 50,160 |
| Logic Array Blocks (LABs) | 2,508 |
| Embedded Memory (bits) | 2,475,072 |
| User I/O Count | 350 |
| Package | 780-pin FBGA (FineLine BGA) |
| Speed Grade | C6 |
| Temperature Grade | Commercial (0C to +85C) |
| Transceiver Data Rate (max) | Up to 3.125 Gbps |
| Hard PCI Express IP | Yes (x1/x4 endpoint and root port, PCIe 1.0) |
| Embedded Multipliers | 18x18 multipliers |
| Process Technology | 90 nm |
| Configuration Modes | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) |
| Supply Voltage (Core) | 1.2 V |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI, PCI-X |
| RoHS Status | Non-Compliant (per Besenchips listing - contains lead) |
EP1AGX50DF780C6 780-pin fbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1AGX50DF780C6 (780-pin fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX50DF780C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX50DF780C6 is suitable for 6 applications: PCI Express Protocol Bridge, Broadcast Video Processing, Wireless Baseband Pre-Processing, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, Storage Area Network Controllers.
PCI Express Protocol Bridge
The EP1AGX50DF780C6 is well-matched to PCI Express bridge applications because it integrates hard PCI Express x1/x4 endpoint and root-port IP blocks compliant with the PCIe 1.0 specification. The 3.125 Gbps transceivers handle the physical layer directly, eliminating soft-logic implementation overhead and freeing fabric for protocol conversion logic. With 50,160 logic elements available, the device can implement a custom application layer plus a bridge to legacy parallel buses (PCI, local bus) in a single chip. Place the FPGA on a card edge connector with the PCIe lanes routed to the dedicated transceiver pairs, and use the embedded PCI Express hard IP block in conjunction with the Quartus II PCIe Compiler to shorten design time.
Recommended
Broadcast Video Processing
The EP1AGX50DF780C6 is widely deployed in broadcast video format converters, scalers, and color-space conversion pipelines. The 2,475,072 bits of embedded RAM buffer multiple video lines at HD/3G-SDI rates, while the 350 user I/Os provide enough parallel bandwidth for multi-channel SDI ingestion and HDMI/DVI output. The embedded 18x18 multipliers handle FIR filters for scaling and chroma resampling in real time. A typical design drives the transceivers with HD-SDI at 1.485 Gbps or 3G-SDI at 2.97 Gbps while the FPGA fabric performs format up/down-conversion. Memory bandwidth is supported through DDR/DDR2 external interfaces connected via SSTL I/O standards.
Recommended
Wireless Baseband Pre-Processing
The Arria GX family is suited to wireless baseband pre-processing functions such as channelization, digital up/down-conversion, and crest-factor reduction. The embedded 18x18 multipliers accelerate the FIR and polyphase filter banks commonly used in DDC/DUC, while the 50,160 logic elements provide headroom for multiple antenna paths in a single device. The 3.125 Gbps transceivers interface cleanly with common wireless backhaul standards such as CPRI and OBSAI. Connect antenna data through on-board ADCs into the FPGA, perform baseband shaping in fabric, and hand off digital samples via transceiver links to the baseband processor. Power estimation should be performed for typical utilization to confirm thermal envelope.
Recommended
Industrial Imaging and Machine Vision
The EP1AGX50DF780C6 is a strong fit for multi-camera machine vision systems, including frame grabbers and pre-processing pipelines. The 350 user I/Os accept multiple parallel Camera Link channels, and the embedded RAM buffers full frames at gigabit rates before edge detection or pattern-matching algorithms run in fabric. The high logic count and embedded multipliers accelerate convolution kernels commonly used in vision preprocessing. The PCI Express hard IP simplifies integration with industrial PCs through standard x1 or x4 slots, eliminating the need for frame grabber host cards. Designers should leverage DDR2 external memory for frame buffering and Camera Link deserializer companion chips for input.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments such as protocol analyzers, logic analyzers, and signal generators leverage the EP1AGX50DF780C6's combination of high-density logic, embedded transceivers, and abundant user I/Os. Designers implement custom triggering, protocol decoding, and signal conditioning in fabric while offloading raw data capture to external DDR2 memory. The transceivers accept high-speed serial test data and recover clocks, while the parallel I/Os handle legacy parallel interfaces. Reuse of the hard PCI Express IP enables streaming captured data directly to a host PC for real-time display. Industrial temperature variants extend usability into laboratory and field environments.
Recommended
Storage Area Network Controllers
The EP1AGX50DF780C6 is well-suited to SAS/SATA controller cards and RAID HBAs because of its multi-gigabit transceiver support and integrated PCI Express hard IP. Implement SAS expander or SATA host controller logic in the FPGA fabric, use the embedded PCIe x4 endpoint to connect to the host system, and leverage the embedded multipliers for XOR parity acceleration in RAID 5/6. The 350 user I/Os drive external SAS/SATA PHY chips, and the 2,475,072 bits of embedded RAM cache command queuing. Choose industrial temperature variants for enterprise storage chassis that require -40C to +100C operation.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX50DF780C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50DF780C7N | EP1AGX50DF780I6N | EP1AGX50DF780C5N | EP1AGX35DF780C6N | EP1AGX35DF780I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 33,520 | 33,520 |
| Embedded Memory (bits) | 2,475,072 | 2,475,072 | 2,475,072 | 2,475,072 | 1,683,840 | 1,683,840 |
| User I/O | 350 | 350 | 350 | 350 | 350 | 350 |
| Speed Grade | C6 | C7 (faster) | I6 (industrial) | C5 (slower) | C6 | I6 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Commercial | Industrial |
| Hard PCI Express IP | Yes (PCIe 1.0 x1/x4) | Yes (PCIe 1.0 x1/x4) | Yes (PCIe 1.0 x1/x4) | Yes (PCIe 1.0 x1/x4) | Yes (PCIe 1.0 x1/x4) | Yes (PCIe 1.0 x1/x4) |
| Transceiver Data Rate (max) | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
Key Differentiators
- Hard PCI Express x1/x4 IP block integrated on-die (vs EP1AGX35DF780C6N (same family, lower density))
- Higher logic capacity (50,160 LE vs 33,520 LE in EP1AGX35) (vs EP1AGX35DF780C6N)
- C6 speed grade balances performance and cost (vs EP1AGX50DF780C7N (faster C7 grade))
- Industrial temperature variant available in same package (vs EP1AGX50DF780I6N (industrial grade))
- Mid-range price point vs higher-end Stratix family (vs Altera Stratix IV (higher-end family))
Design Notes
The EP1AGX50DF780C6 core supply is 1.2 V with multiple auxiliary rails (VCCPD, VCCPT, VCCAUX, VCCAUX_RX, VCCAUX_TX, VCCBAT). Each rail requires its own decoupling network: a 100 uF bulk capacitor near the regulator, multiple 4.7 uF and 0.1 uF ceramics placed adjacent to the supply pins on the 780-FBGA package, and a high-frequency 0.01 uF cap at each pin pair. Estimated: at 50% logic utilization with active transceivers, the device typically draws 1.5 A to 3.0 A on VCCINT (1.2 V); budget the regulator for at least 4 A to handle worst-case utilization spikes. Power sequencing must follow the manufacturer datasheet order - VCCINT before VCCPD before VCCAUX.
The 780-pin FBGA uses a 1.0 mm ball pitch, which requires 4-layer or 6-layer PCB stack-up with laser-drilled or micro-via technology. Route high-speed transceiver differential pairs with 100 ohm differential impedance and matched length (within 150 mil for 3.125 Gbps). Decoupling capacitors must be placed on the opposite side of the BGA using via-in-pad if necessary to minimize loop inductance. Reference the official Arria GX device handbook PCB layout guidelines for via pattern, antipad sizing, and ground plane stitching. Estimate: use at least 30 stitched ground vias around the BGA perimeter for return path integrity.
Transceiver channels operate up to 3.125 Gbps in C6 grade; maintain strict impedance control on the PCB and AC-couple the transmit pairs per the IBIS-AMI model recommended in the Arria GX handbook. Use the dedicated REFCLK inputs for each transceiver bank and avoid sharing reference clocks across long distances. LVDS I/O should use matched-pair routing with 100 ohm differential impedance and length-matching within 50 mil. DDR2 memory interfaces should follow the JEDEC DDR2 SSTL-18 layout with matched length on byte lanes and proper fly-by termination topology.
Common pitfalls when designing with the EP1AGX50DF780C6 include: (1) omitting the VCCBAT pin which preserves configuration RAM and must be tied to a battery or always-on supply; (2) failing to use MSEL pins correctly for the desired configuration mode (PS, FPP, AS); (3) using JTAG TCK faster than the recommended maximum when debugging; (4) ignoring the nSTATUS and CONF_DONE pin pull-up requirements during configuration; (5) assuming Cyclone V or Arria V bitstream compatibility - the Arria GX requires the legacy Quartus II toolchain, not Quartus Prime. Always validate the pin assignments against the device handbook pin-out file before PCB fabrication.
Estimated: at 85C ambient and typical utilization (50% logic + 4 active transceivers), the EP1AGX50DF780C6 dissipates approximately 5-7 W. The 780-FBGA package thermal resistance theta_JA is approximately 12 C/W with a properly designed 6-layer PCB and bottom-side thermal vias; junction temperature must remain below 125C for commercial grade. For higher-power designs with all transceivers active and high toggle rates, consider attaching a heatsink or using airflow. Industrial variants (EP1AGX50DF780I6N) extend the junction operating range to 100C, allowing higher ambient deployments but requiring the same thermal design.
Compliance Information
Per Besenchips listing, EP1AGX50DF780C6 contains lead and is RoHS non-compliant. Other compliance fields not stated in the verified data; consult Intel/Altera product declaration documents directly for full REACH, halogen, and conflict-minerals status.
