EP1C12F256C8 vs EP1C12F256C6N Comparison
Detailed side-by-side comparison of EP1C12F256C8 by Intel and EP1C12F256C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP1C12F256C6N - 12,060 LEs Cyclone FPGA 256-BGA | Intel / Altera
EP1C12F256C6N ⚠ Last Time BuySpecification Comparison
| Parameter | EP1C12F256C8 | EP1C12F256C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $35.20 | $51.90 |
| Series | Cyclone | — |
| Family | Cyclone I | Cyclone® |
| Logic Elements (LE) | 12,060 | — |
| Total RAM Bits | 239,616 | — |
| Number of LABs/CLBs | 1,206 | — |
| Number of Logic Elements/Cells | 12,060 | — |
| Number of I/O | 185 | — |
| Number of PLLs | 2 | — |
| Total Memory Bits | 239,616 | — |
| Package / Case | 256-BGA (FBGA) | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | 0°C to +85°C (commercial grade) | 0 °C to +85 °C (commercial) |
| Core Voltage | 1.5 V | — |
| I/O Voltage Range | 1.5 V to 3.3 V | — |
| Supplier Device Package | 256-FBGA (17x17 mm) | — |
| Process Technology | 130 nm SRAM | 0.13 µm SRAM |
| Configuration Method | Passive Serial / Active Serial / JTAG | Serial (EPCS) / JTAG |
| Logic Elements (LEs) | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Embedded Memory Bits | — | 239,616 bits |
| M4K RAM Blocks | — | 52 |
| Embedded 18x18 Multipliers | — | Yes |
| PLLs | — | 2 |
| Maximum User I/O | — | 185 |
| User I/O Banks | — | [DATA_NEEDED: number of user I/O banks] |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Package | — | 256-ball FBGA (F256) |
| Speed Grade | — | 6 |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |